Assembly & rework processes for large and complex PCBs using lead-free solder

摘要

The continued functional densification and integration in networking products is driving the need to study large form factor printed circuit boards that use high I/O packages (either ceramics column grid arrays, CCGA, or plastic ball grid array, PBGA). As of today, there has been limited work on understanding the impact of lead-free soldering on these large and complex assemblies. This paper will look at larger packages (up to 52.5mm square with 2577 I/O) in combination with lead-free soldering. Assembly processes such as solder paste printing and reflow soldering will be studied and the results presented. The rework of these component types will be evaluated and the key issues for developing a successful rework process will be discussed.