implement lead-free soldering processes for optical materials metallfassungen and broader assemblies

摘要

An assembly includes a part made of transparent material, in particular, quartz glass or calcium fluoride, and a metal part soldered. The following layer structure is present in the region of a solder joint: a transparent material of the transparent material part, an adhesion layer, a diffusion barrier layer, a first oxidation protection layer, a second oxidation protection layer, a solder layer, as required, a wetting auxiliary layer, and a metal of the metal part, respectively with transitions between the layers, in particular, in the typical manner for soldering, and possibly with diffusion of the two oxidation protection layers into the solder.