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USE OF A LEAD-FREE SOLDER ALLOY PASTE FOR MANUFACTURING PCB
USE OF A LEAD-FREE SOLDER ALLOY PASTE FOR MANUFACTURING PCB
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机译:使用无铅焊锡膏制造PCB
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摘要
Tombstoning susceptibility and reflow peak temperature reduction of solder alloys, in particularly lead-free solder alloys, has been found to be achieved effectively by mixing the solder alloy in the form of an alloy paste with a low melting alloy utilised in powder form, in particular a Bi-containing alloy.
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