This article explores the effects of phosphorus addition on the wettability between Sn-9Zn solder alloy and Cu substrates, the oxidation behavior and the corrosion behavior of Sn-9Zn solder alloy. Spreading test was used to characterize the wettability of Sn-9Zn-xP solder alloys to Cu substrates. The oxidation and corrosion behaviors of Sn- 9Zn-xP solder alloys were determined by means of weight gaining, and secondary ion mass spectrometry was used to analyze the oxygen content. The role and mechanism of P in the solder alloys were also discussed. It is found that the addition of P can significantly improve the wettability of the solder alloys. Incorporating P into Sn-9Zn solder alloy obviously decreases the oxygen content and enhances the oxidation and corrosion resistance. Microstructure observations show that an appropriate amount of P can greatly refine coarse rod-like Zn-rich phases in Sn-9Zn solder alloy.
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机译:Yield lncreasing and Quality lmproving Effects of Smash-ridging Method ("4453"Effects) and lts Potential in Benefiting the Nation and the People粉垄“4453”增产提质效应及其利民利国发展潜能