Bonding of Si chips to low carbon steel boards using electroplated Sn solder

Hsu Shou-Jen; Lee Chin C.

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Bonding of Si chips to low carbon steel boards using electroplated Sn solder

机译：使用电镀SN焊料将Si芯片与低碳钢板的粘合

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摘要

Purpose The purpose of this research was to develop a new process to bond silicon (Si) chips to low carbon steel substrates using pure tin (Sn) without any flux.

机译：目的本研究的目的是使用纯TiN（Sn）在没有任何通量的纯锡（Sn）中，将粘合硅（Si）芯片粘合到低碳钢基板的新方法。

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来源
《Soldering & Surface Mount Technology》 |2018年第4期|共4页
作者
Hsu Shou-Jen; Lee Chin C.;
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作者单位

Univ Calif Irvine Mat &

Mfg Technol Irvine CA 92697 USA;

Univ Calif Irvine Elect Engn &

Mat Sci Irvine CA USA;

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原文格式 PDF
正文语种 eng
中图分类焊接一般性问题;
关键词
Solder; Carbon steel;

机译：焊料;碳钢;

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专利

1. Bonding of Si chips to low carbon steel boards using electroplated Sn solder [J] . Hsu Shou-Jen, Lee Chin C. Soldering & Surface Mount Technology . 2018,第4期

机译：使用电镀SN焊料将Si芯片与低碳钢板的粘合
2. Fluxless Flip-Chip Solder Joint Fabrication Using Electroplated Sn-Rich Sn-Au Structures [J] . Jongsung Kim, Dongwook Kim, Chin C. Lee IEEE Transactions on Advanced Packaging . 2006,第3期

机译：电镀锡富锡锡金结构的无助焊剂倒装芯片焊点制造
3. Effect of multiple reflows on interfacial reaction and shear strength of Sn-Ag electroplated solder bumps for flip chip package [J] . Sang-Su Ha, Jin-Kyu Jang, Sang-Ok Ha, Microelectronic Engineering . 2010,第3期

机译：多次回流对倒装芯片封装的Sn-Ag电镀焊料凸块的界面反应和剪切强度的影响
4. Evaluation of the Oven Reflow Bonding and Flip Chip Bonder Bonding of Lead Free Sn0.7Cu Solder Bumped Die on Low-cost FR-4 Substrate for Flip-chip Applications [C] . Esther W. C. Yau, Benny F. W. Hong, Philip C. H. Chan Electronic Components Technology Conference . 2003

机译：无铅SN0.7CU焊料凸芯片焊接对倒装芯片应用的低成本FR-4基板上无铅SN0.7CU焊接模具的烤箱回流粘接和倒装芯片粘结粘接
5. Fluxless bonding technology using electroplated multilayer solder structures [D] . Kim, Jongsung 2007

机译：使用电镀多层焊料结构的无助焊技术
6. Tensile property improvement of TWIP-cored three-layer steel sheets fabricated by hot-roll-bonding with low-carbon steel or interstitial-free steel [O] . Jaeyeong Park, Jung-Su Kim, Minju Kang, -1

机译：通过低碳钢或无间隙钢热轧结合制成的TWIP芯三层钢板的拉伸性能提高
7. Bonding of Si chips to low carbon steel boards using electroplated Sn solder [O] . Shou-Jen Hsu, Chin C. Lee 2018

机译：使用电镀SN焊料将Si芯片与低碳钢板的粘合

Bonding of Si chips to low carbon steel boards using electroplated Sn solder

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