FABRICATION METHODS OF THERMOELECTRIC THIN FILM MODULES USING COMBINED PROCESSES OF ADHESIVE FLIP CHIP BONDING AND SOLDER REFLOW FLIP CHIP BONDING AND THERMOELECTRIC THIN FILM MODULES PRODUCED USING THE SAME METHOD

摘要

The present invention relates to a thermoelectric thin film module and, more specifically, to a method for manufacturing a thermoelectric thin film module using combined processes of adhesive flip chip bonding and solder reflow flip chip bonding in order to prevent fault during a manufacturing process and to improve reliability, and to a thermoelectric thin film module manufactured by the same. As a non-conductive adhesive surrounds thermoelectric thin film legs and a solder and a bonding pad mechanically combined to the solder before solder reflow, a reflowed and fused solder can not be spread along the thermoelectric thin film leg or a thin film electrode differently from the previous technology and thus short fault due to solder bridging occurring in the previous technology can be prevented. Also, the non-conductive adhesive surrounding the thermoelectric thin film legs absorbs external impact and can improve reliability by preventing reaction between the thermoelectric thin film legs and moisture, differently from the previous technology.