Fabrication methods of thermoelectric thin film modules using adhesive flip chip bonding and thermoelectric thin film modules produced using the same method

摘要

The present invention relates to a thermoelectric thin film module, and more particularly, to a thermoelectric thin film module in which thermoelectric thin film legs are flip-chip bonded using an anisotropic conductive adhesive or nonconductive adhesive in order to prevent defects during the manufacturing process and to improve characteristics and reliability And a thermoelectric thin film module comprising the thermoelectric thin film module.