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Dislocation structure formation in SiGe/Si(001) heterostructures with low-temperature buffer layers

机译:具有低温缓冲层的SiGe / Si(001)异质结构中的位错结构形成

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Mechanisms of misfit dislocation generation as well as peculiarities of dislocation structure formation in Si0.7Ge0.3/Si multilayer heterostructures grown by molecular beam epitaxy with low-temperature (LT) SiGe and (SiGe+Si) buffer layers were studied. Full strain relaxation in the heterostructures with 200-250 nm thick buffer layers has been achieved. In the heterostructures with both types of LT layer, misfit dislocation generation is found to proceed similarly to heterostructure growth at high temperatures; however, the rate of dislocation nucleation is higher due to the high vacancy concentration near the interface. Threading dislocations, which are not connected with misfit dislocation network. are generated in the epitaxial layers apart from the SiGe-Si interface to form a dislocation density of 10(7)-10(8) cm(-2) on the surface. [References: 12]
机译:研究了低温(LT)SiGe和(SiGe + Si)缓冲层通过分子束外延生长Si0.7Ge0.3 / Si多层异质结构中失配位错的产生机理以及位错结构形成的特殊性。已经实现了具有200-250 nm厚缓冲层的异质结构中的完全应变松弛。在两种类型的LT层的异质结构中,错配位错的产生都类似于高温下异质结构的生长。然而,由于界面附近的高空位浓度,位错成核的速率更高。螺纹位错,不与错位错位网络连接。在除SiGe-Si界面以外的外延层中产生的Si在表面上形成10(7)-10(8)cm(-2)的位错密度。 [参考:12]

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