Mechanical reliability evaluation of Sn-37Pb solder joint using high speed lap-shear test

摘要

This study utilized a high speed lap-shear test to evaluate the mechanical behavior of Sn-37Pb/Cu under bump metallization (UBM) solder joints under high speed loading and hence the drop reliability. The samples were aged for 120 h at different temperatures (150 ℃, 180 ℃) and then tested at different displacement rates in the range of 0.01 mm/s to 500 mm/s to examine the effects of aging on the drop reliability. The combination of the stress-strain graphs captured from the shear tests and the fracture morphology analysis discloses that the aging at high temperatures has influenced critically the deformation behavior of the solder joints and the effects appears more significant at high strain rates. This study demonstrates a unique capability of a drop reliability evaluation method that utilizes a high speed lap-shear test.