Test probe for examining soldered joint mechanical quality - subjects joint to mechanical stress and detects resulting ultrasonic resonant signal

摘要

The test probe for examining the mechanical quality of soldered joints subjects the soldered joint to a step function or alternatively repeated, stress and which has a facility for detecting the resulting ultrasonic resonant signal produced by the joint. The probe consists basically of a roughly cylindrical pressure element (3) which makes contact with the solder (1) once a flat interface (4, 5). A force (P), which can either be of a step function type, or alternatively of a repetitive type, is applied through the head to the solder (1), and a pickup probe (6) within the pressure head, detects the ultrasonic resonant signal produced by the joint. The processing of this signal is not described.