Mechanical Reliability Evaluation of Sn-37Pb/Cu and Sn-37Pb/ENIG Solder Joints by using High Speed Lap-shear Test

摘要

This study utilized out high speed lap-shear tests at various strain rates (0.01 mm/s ～ 500 mm/s) for Sn-37Pb/Cu and Sn-37Pb/ENIG solder joints to evaluate the drop reliability. The samples aged for 120 h at different temperatures (150°C and 170°C) were also tested to examine the effects of aging on the drop reliability. We thoroughly analyzed the stress-strain curves obtained from the lap-shear tests and the fractured surfaces. This analysis generated insightful information that reveals three fracture surface types active in our samples. This study also elucidates different fracture mode for the Sn-37Pb/Cu and Sn-37Pb/ENIG solder joints. This study successfully demonstrates that the analysis based on a high speed lap-shear test could be critically used to evaluate the drop reliability of solder joints.