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Numerical analysis of Double Gate and Gate All Around MOSFETs with bulk trap states

机译:具有整体陷阱状态的双栅和全栅MOSFET的数值分析

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摘要

This paper investigates the scaling capability of Double Gate (DG) and Gate All Around (GAA) MOSFETs using a numerical analysis of the two-dimensional coupled Boltzmann distribution-Poisson equations in which the traps effects have been considered. Using this numerical model, we have studied the effects of the defects on the scalability limits of DG and GAA MOSFETs and compared their performances. We have found that, the scaling capability of both architectures made in recrystallized silicon will be improved as the diameter (or silicon thickness for DG structure) of device is reduced, because the small device size decreases the defect density in the channel.
机译:本文利用二维耦合玻耳兹曼分布-泊松方程的数值分析研究了双栅(DG)和全栅(GAA)MOSFET的缩放能力,其中已经考虑了陷阱效应。使用此数值模型,我们研究了缺陷对DG和GAA MOSFET可扩展性极限的影响,并比较了它们的性能。我们发现,由于减小了器件的直径(或减小了DG结构的硅的厚度),由于较小的器件尺寸减小了沟道中的缺陷密度,所以用重结晶的硅制成的两种架构的缩放能力都将得到改善。

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