首页> 美国政府科技报告 >Study of Gate Oxide Leakage and Charge Trapping in ZMR (Zone-Melting-Recrystallized) and SIMOX (Oxygen-Implanted) SOI (Silicon-On-Insulator) MOSFET's
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Study of Gate Oxide Leakage and Charge Trapping in ZMR (Zone-Melting-Recrystallized) and SIMOX (Oxygen-Implanted) SOI (Silicon-On-Insulator) MOSFET's

机译:ZmR(区域熔化 - 再结晶)和sImOX(氧注入)sOI(绝缘体上硅)mOsFET中的栅极氧化物泄漏和电荷俘获的研究

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摘要

Characterization of gate oxides grown on AMR and SIMOX films indicates oxide leakage and charge trapping to be several orders of magnitude greater than their bulk silicon counterpart. Electron trapping is the primary trapping mechanism for constant current injection in the gate oxides of these SOI films. Similar type of traps are observed in ZMR and SIMOX oxides. Semiconductor films, Reprints. (JES)

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