机译:β-Sn晶粒c轴对BGA Sn3.0Ag0.5Cu焊料互连中电迁移行为的影响
College of Material Science and Engineering, Beijing University of Technology, Beijing, China;
College of Material Science and Engineering, Beijing University of Technology, Beijing, China;
College of Material Science and Engineering, Beijing University of Technology, Beijing, China;
机译:Sn晶粒c轴对Cu增强复合焊点电迁移的影响
机译:Cu / Sn3.0Ag0.5Cu / Cu球栅阵列焊点的电迁移行为
机译:电迁移期间Cu6SN5增强复合复合焊点Cu6Sn5生长行为的晶粒取向对电迁移的影响
机译:Sn3.0Ag0.5Cu / Sn58Bi结构复合焊料互连的电迁移行为
机译:静态和动态时效对Sn3.0Ag0.5Cu钎料合金疲劳行为的影响
机译:SN-3.0AG-0.5CU焊点电迁移诱导的晶粒旋转和微观结构演化的原位观察
机译:电迁移对焊点形成的影响:99.3sn-0.7Cu与96.5sn-3.0ag-0.5Cu无铅焊料的比较