机译:Sn晶粒c轴对Cu增强复合焊点电迁移的影响
College of Material Science and Engineering, Beijing University of Technology;
College of Material Science and Engineering, Beijing University of Technology;
College of Material Science and Engineering, Beijing University of Technology;
College of Material Science and Engineering, Beijing University of Technology;
College of Material Science and Engineering, Beijing University of Technology;
机译:SN晶粒C轴对电迁移下Cu加强复合焊点Cu原子运动的影响
机译:电迁移期间Cu6SN5增强复合复合焊点Cu6Sn5生长行为的晶粒取向对电迁移的影响
机译:Sn谷物C轴和电子流向在电流应力下Cu加强复合焊点上的角度的影响
机译:电迁移到焊点形成的影响:99.3sn-0.7cu和96.5sn-3.0ag-0.5cu无铅焊料之间的比较
机译:利用实验室规模X射线计算机断层扫描技术对Sn-0.7Cu焊料中的电迁移过程进行量化。
机译:SN-3.0AG-0.5CU焊点电迁移诱导的晶粒旋转和微观结构演化的原位观察
机译:电迁移对焊点形成的影响:99.3sn-0.7Cu与96.5sn-3.0ag-0.5Cu无铅焊料的比较