机译:电迁移期间Cu6SN5增强复合复合焊点Cu6Sn5生长行为的晶粒取向对电迁移的影响
Beijing Univ Technol Coll Mat Sci &
Engn Beijing 100124 Peoples R China;
Beijing Univ Technol Coll Mat Sci &
Engn Beijing 100124 Peoples R China;
Beijing Univ Technol Coll Mat Sci &
Engn Beijing 100124 Peoples R China;
Beijing Univ Technol Coll Mat Sci &
Engn Beijing 100124 Peoples R China;
Composite solder; electromigration; grain orientation; Cu6Sn5 growth behavior;
机译:电迁移期间Cu6SN5增强复合复合焊点Cu6Sn5生长行为的晶粒取向对电迁移的影响
机译:电迁移测试中5Sn-95Pb / 63Sn-37Pb复合倒装芯片焊点中Pb晶粒的取向转变
机译:Sn晶粒c轴对Cu增强复合焊点电迁移的影响
机译:Sn3.0Ag0.5Cu无铅焊点中Cu6Sn5晶粒取向的分析
机译:SNBI系统的电迁移行为:对低温焊点可靠性的影响
机译:在焊点中单个Cu6Sn5晶粒中成像多态转变
机译:PCB表面饰面对SN-3.0AG-0.5CU PB焊点的原位金属间化合物生长和电迁移特性