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2011 12th International Conference on Electronic Packaging Technology & High Density Packaging

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1.Study on solder joint image segmentation techniques based on Matlab

机译：基于Matlab的焊点图像分割技术研究
- 作者：Zhu Shaohua;Wu Zhaohua
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
2.Pad design, soldering technology and reliability of package on package — Study on the deformation of printed board

机译：焊盘设计，焊接技术和封装在封装上的可靠性—研究印制板的变形
- 作者：Ming Fang;Wang Yuming;Cai Jian;Gao Jiancun
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
- Deformation;
- FEM;
- PCB;
- Package-on-package (PoP);
- Reliability;
- Soldering technology;
3.SMD reliability research base on Stolkarts fatigue model

机译：基于Stolkarts疲劳模型的SMD可靠性研究
- 作者：Wang Zhao;Zhao Heming;Lou Wenzhong;Li Hanwei;Jin Li
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
4.Study on intelligent identification technology of solder joints defects based on LMBP neural network

机译：基于LMBP神经网络的焊点缺陷智能识别技术研究
- 作者：Wu Zhaohua
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
5.Solder prefrom application

机译：焊料瓶胚的应用
- 作者：Yu Hu;Ming Shen;Gong Angela;Lu Alan
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
6.Study on the heat dissipation of the thermal via in T/R modules based on BP-GA

机译：基于BP-GA的T / R模块中散热孔散热的研究
- 作者：Bi Tang-wen;Zhou De-jian
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
- T/R modules;
- genetic algorithm;
- neural network;
- thermal via;
7.The intelligent detection method study of PQFP solder joint defects based on improved neural network

机译：基于改进神经网络的PQFP焊点缺陷智能检测方法研究
- 作者：Yan Tianxiang;Zhou Dejian
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
8.Mechanical and electronic analysis of 3D embedded capacitor filling with conductive adhesive

机译：导电胶填充3D嵌入式电容器的机械和电子分析
- 作者：Wang Huijuan;Yu Daquan;He Ran;Dai Fengwei;Cao Liqiang;Wan Lixi
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
9.A new measurement method and electrical design for high density optoelectronics integration

机译：高密度光电集成的新测量方法和电气设计
- 作者：Liu Fengman;Li Baoxia;Zhou Yunyan;Gao Wei;Xiang Haifei;Wang Haidong;Song Jian;Li Zhihua;Yang Kun;Li Jun;Cao Liqiang;Wan Lixi
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
10.Silver Nitric-An innovative process indicator for oxidation of PCB with OSP finish

机译：硝酸银-用于OSP表面处理的PCB氧化的创新工艺指示器
- 作者：Hou Eric;Chung D. F.;Wang Paul
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
- OSP;
- Organic Solderability Preservative (OSP);
- PCB;
- Silver Nitric AgN0inf3/inf;
- hole fillet;
- lead-free;
- lead-free soldering;
- process indicator;
- surface finish;
11.Research on dimensional change characteristics of silver halide films for multi-layer PCBs

机译：多层PCB用卤化银薄膜尺寸变化特性的研究
- 作者：Zhou Liangjie;Peng Weihong;Liu Dong;Zou Rubin;Jiang Xuefei;Xia Weisheng;Wu Fengshun
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
12.Design for manufacturability of PTH solder fill in thick board with OSP finish

机译：PTH焊料的可制造性设计，填充在具有OSP涂层的厚板上
- 作者：Chang Shining;Wang Rocky;Xiang Yu;Wang Paul;Shi William
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
- GND;
- OSP;
- PCB;
- gap ratio;
- hole fillet;
- lead-free;
- thick;
- wave solder;
13.Investigation on cracked solder ball of BGA component

机译：BGA元件开裂焊球的研究
- 作者：Cai M.;Wu B. Y;Yang D. G;Xie D. J;Tao Y.;Su X. X;Zhou F.
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
- Cracked;
- Failure mechanism;
- Intermetallic Matrix Composites (IMC);
- Pin pull test;
- Solder ball;
- electronic products;
14.Void mechanism research and control in solder joint

机译：焊点空隙机理的研究与控制
- 作者：Xiaoqiang Xie;Jianwei Zhou;Jonghyun Chae;Myungkee Chung
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
15.Development of a three-dimensional integrated solder ball bumping bonding method for MEMS devices

机译：MEMS器件的三维集成焊球凸焊和键合方法的开发
- 作者：Yang Lei;Liu Wei;Wang Chunqing;Tian Yanhong
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
16.An experimental investigation on thermal contact resistance across metal contact interfaces

机译：金属接触界面热接触电阻的实验研究
- 作者：Luo Xiaobing;Feng Han;Liu Jv;Liu Ming Lu;Liu Sheng
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
17.Investigation of high speed micro-bump formation through electrodeposition enhanced by megasonic agitation

机译：超声速搅拌下电沉积形成高速微凸点的研究
- 作者：Tian Yingtao;Liu Changqing;Hutt David;Stevens Bob;Flynn David;Desmulliez Marc P.Y.
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
18.Laser bonding system for semiconductor device and MEMS encapsulation

机译：用于半导体器件和MEMS封装的激光焊接系统
- 作者：Huang Yuanhao;Li Maoyu;Lai Yuneng;Chen Zunmiao;Zhang Jianhua
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
19.A novel design of handling system for silicon wafer thinning

机译：硅片减薄处理系统的新颖设计
- 作者：Li Cao;Zhou Shengjun;Hu Chang;Wang Xuefang;Liu Sheng
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
20.Study of GaN-based light-emitting diodes with double roughened surfaces

机译：具有双粗糙表面的GaN基发光二极管的研究
- 作者：Yang Lianqiao;Hu Jianzheng;Zhang Jianhua
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
21.Packaging of high power density double quantum well semiconductor laser array using double-side cooling technology

机译：利用双面冷却技术封装高功率密度双量子阱半导体激光器阵列
- 作者：Wang Jingwei;Zhang Pu;Xiong Lingling;Li Xiaoning;Yuan Zhenbang;Guo Lu;Liu Xingsheng
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
22.Simulations for a novel fluid dispensing technology based on gas-liquid slug flow

机译：基于气液弹团流的新型流体分配技术的仿真
- 作者：Peng Peng;Zhang Jianhua;Zhang Jinsong
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
- fluid dispensing;
- gas-liquid two-phase flow;
- microchannel;
- numerical simulation;
- slug flow;
23.Channel quality comparison for OOGIO bus designs

机译：OOGIO总线设计的通道质量比较
- 作者：Li Y. L.;Ye Xiaoning;Xiao Kai;Su Thonas;Kang Karen
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
24.The stress-strain behaviors of solder joints during thermal fatigue process

机译：热疲劳过程中焊点的应力-应变行为
- 作者：Zhiting Geng;Heqing;Guohai Cheng;Jusheng Ma
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
- lead-free solder;
- stress-strain;
- thermal fatigue;
25.In situ measurement of stress evolution in Sn-based solder joint under electromigration based on X-ray diffraction technique

机译：基于X射线衍射技术的电迁移下Sn基焊点应力演变的原位测量
- 作者：He Hongwen;Zhao Haiyan;Ma Limin;Xu Guangchen;Guo Fu
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
26.A damage model for SnAgCu solder under thermal cycling

机译：SnAgCu焊料在热循环下的损伤模型
- 作者：Xiao Hui;Li Xiaoyan;Liu Na;Yan Yongchang
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
27.Residual stress estimation of NCF-bonded COG packages during manufacturing process

机译：NCF键合的COG封装在制造过程中的残余应力估算
- 作者：Guo Jie;Tao Bo;Yin Zhouping
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
28.Investigation on soldering reliability in terminal electrodes of MLCC

机译：MLCC端子电极的焊接可靠性研究
- 作者：Shi GuangHua;Bao ShengXiang;Li Peng;Lai Weiming;Rao Zhenzhen
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
29.Migration of sintered nanosilver die-attach material on alumina substrate at high temperatures

机译：高温下烧结纳米银芯片附着材料在氧化铝基板上的迁移
- 作者：Mei Yunhui;Ibitayo Dimeji;Chen Xu;Luo Susan;Lu Guo-Quan
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
- High-temperature die-attach;
- Low-temperature sintering;
- Nanosilver paste;
- Silver migration;
30.Irregular tin whisker growth on the surface of Sn-3.8Ag-0.7Cu-1.0RE solder joints

机译：Sn-3.8Ag-0.7Cu-1.0RE焊点表面不规则锡晶须生长
- 作者：Hao Hu;Tian Jun;Xu Guangchen;Guo Fu;Song Yonglun;Shi Yaowu
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
31.In situ measurement and binning system of LED for improved color consistency

机译：LED的原位测量和分级系统，可改善色彩一致性
- 作者：Zhou Shengjun;Liu Sheng
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
32.Analysis of temperature field of Embedded Multi-Chip Module

机译：嵌入式多芯片模块温度场分析
- 作者：Chunyue Huang;Bin Wang;Tianming Li;Hegeng Wei
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
33.Tensile Properties of PV Ribbons with Sn-Pb Coatings

机译：具有Sn-Pb涂层的PV带的拉伸性能
- 作者：Wu Xuewei;Ding Dongyan;Han Bai;Yu Yunhong;Wang Yimin;Li Ming;Mao Dali
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
34.Tin whisker formation on electroless tin films deposited on lead-frame alloys

机译：在引线框架合金上沉积的化学镀锡膜上形成锡晶须
- 作者：Liu Ting;Wang Yiqing;Ding Dongyan;Galuschki Klaus-Peter;Hu Yu;Gong Yihua;Li Ming;Mao Dali
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
35.Phase segregation under reversed current stressing in eutectic Sn-based solder joints

机译：共晶锡基焊点在反向电流应力下的相分离
- 作者：Liu Sihan;Xu Guangchen;Guo Fu
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
36.Preparation and properties of electroless deposited NiP, NiWP as barrier layer on p-type Si

机译：在p型Si上化学沉积NiP和NiWP作为阻挡层的制备及其性能。
- 作者：Xin Yuhang;Li Ming;Mao Dali
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
- Electroless deposition;
- Metal silicide;
- diffusion barrier layer;
- nickel tungsten alloy;
37.Failure analysis of thick film resistors on stainless steel as sensing elements

机译：不锈钢厚膜电阻作为传感元件的失效分析
- 作者：Zhang Zongyang;Wan Zhimin;Wang Simin;Liu Sheng
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
- Failure analysis;
- Sensing element;
- Steel substrate;
- Thick film resistor;
38.Effects of combined thermal and vibration loadings on the wire bond integrity

机译：热和振动载荷组合对引线键合完整性的影响
- 作者：Kamaludin K. A.;Mirgkizoudi M.;Liu C.;Riches S.
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
39.Size and volume effects in microscale solder joint of electronic packaging

机译：电子封装微型焊点的尺寸和体积效应
- 作者：Yin Li-Meng;Li Wang-Yun;Wei Song;Xu Zhang-Liang
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
40.Bonding wire options and their impact on product reliability

机译：键合线选项及其对产品可靠性的影响
- 作者：Vath Charles J.;Holliday Richard
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
41.Application of response surface methods in Lead-free solder joints of plastic ball grid array thermal fatigue life prediction

机译：响应面法在塑料球栅阵列无铅焊点热疲劳寿命预测中的应用
- 作者：Qiang Zhao;Zhou Dejian
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
42.Correlation between Ag content and Cu pad consumption in lead-free solder joints under electron current stressing

机译：电子电流应力下无铅焊点中Ag含量与Cu焊盘消耗的相关性
- 作者：Chen C. N.;Chen B. Z.;Wu W. H.;Ho C. E.
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
- β-Sn orientation;
- Ag effect;
- Cu consumption;
- EBSD;
- Sn-Ag-Cu;
- electromigration;
43.Oxidation behavior of Sn-9Zn-3Bi-xCr solders under high-temperature exposure

机译：Sn-9Zn-3Bi-xCr焊料在高温下的氧化行为
- 作者：Hu Jing;Hu Anmin;Li Ming;Mao Dali
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
44.SOP package surface discoloration after PCT test

机译：PCT测试后SOP包装表面变色
- 作者：Wang Mu-Chun;Yang Hsin-Chia;Liu Chuan-Hsi;Yang Ren-Hau
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
45.Dynamic bending test and simulation of PBGA packages

机译：PBGA封装的动态弯曲测试和仿真
- 作者：Long Lin;Li Guoyuan;Liao Xiaoyu;Xie Bin;Shi Xunqing
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
- FEA;
- dynamic bending;
- electronic package;
- solder joints;
46.Leakage failure analysis of pole pieces used for traveling wave tube

机译：行波管用极靴泄漏失效分析
- 作者：Peng Li;Sheng-xiang Bao;Guang-hua Shi;Wei-ming Lai;Rao-Zhenzhen
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
47.The solder volume effect on the creep behavior of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints

机译：焊料量对BGA结构Cu / Sn-3.0Ag-0.5Cu / Cu接头的蠕变行为的影响
- 作者：Xun-Ping Li;Jian-Min Xia;Xin-Ping Zhang
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
48.Discoloration mechanism of silver-filled adhesive used for packaging solder joint

机译：包装焊点用银填充胶的变色机理
- 作者：Rao Zhenzhen;Bao Shengxiang;Lai Weiming;Shi Guanghua;Li Peng;Ye Jianhai
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
49.The study on information extraction of BGA solders joint 2-D morphology based on wavelet modulus maximum

机译：基于小波模最大的BGA焊点二维形态信息提取研究
- 作者：Yuan Wan;De-jian Zhou
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
50.Effect of fixation method on solder joint vibration fatigue reliability of high density PCB assembly

机译：固定方法对高密度PCB组件焊点振动疲劳可靠性的影响
- 作者：Qi Xueli;Zhou Bin;Li Guoyuan;Zhang Pengfei;En Yunfei
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
51.Study on the adhesion and reliability of Epoxy Molding Compound and shaped Pd Preplated leadframes

机译：环氧树脂与成型钯预制引线框架的附着力和可靠性研究。
- 作者：Ni Mingzhi;Zhang Wenjing;Li Ming;Mao Dali
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
52.Plasma decapsulation of plastic IC packages with copper wire bonds for failure analysis

机译：用铜丝焊对塑料IC封装进行等离子解封以进行故障分析
- 作者：Tang J.;Ye H.;Schelen J.B.J.;Beenakker C.I.M.
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
53.Reliability aanalysis on the solder joints in space cable connectors

机译：空间电缆连接器焊点的可靠性分析
- 作者：Xiao-chao Zhang;Zhen-ming Zhang;Meng Yang
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
54.The common failure mechanisms of plastic encapsulated devices induced by package defect

机译：包装缺陷导致塑料封装器件常见失效机理
- 作者：Chen Yuan;Li Ping
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
55.Experiments and numerical simulation on the performance of LED subjected to thermal shock

机译：LED在热冲击下的性能实验与数值模拟
- 作者：Gui Xulong;Liu Sheng
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
56.Transmission electron microscopy investigations on the growth of tin whiskers from CeSn3 substrate

机译：透射电子显微镜研究CeSn3衬底上锡晶须的生长
- 作者：Li Cai-Fu;Liu Zhi-Quan;Shang Jian-Ku
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
57.A stress-related model for reliability lifetime estimation of ACA joints based on accelerated failure date

机译：基于加速失效日期的ACA接头可靠性寿命估算的应力相关模型
- 作者：Wu Guanghua;Tao Bo
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
58.Drop impact test on high power light emitting diodes module

机译：大功率发光二极管模块的跌落冲击测试
- 作者：Peng Tao;Wang Xuefang;Chen Mingxiang;Chen Run;Liu Sheng
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
59.Application of silicon stress sensor in flip chip packaging system

机译：硅应力传感器在倒装芯片封装系统中的应用
- 作者：Jiang Chengjie;Xiao Fei;Yang Heng;Dou Chuanguo
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
- chip size;
- flip chip;
- stress sensor;
- underfill;
60.Prognostics and reliability assessment of light emitting diode packaging

机译：发光二极管封装的预测和可靠性评估
- 作者：Sutharssan Thamo;Bailey Chris;Stoyanov Stoyan;Rosunally Yasmine
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
61.Thermomigration in Sn58Bi solder joints at low ambient temperature

机译：在低环境温度下Sn58Bi焊点中的热迁移
- 作者：Ding Lan;Tao Yuan;Wu Yiping
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
62.Improved humidity resistance of leaded packages through solder dip process

机译：通过浸焊工艺改善了引线封装的耐湿性
- 作者：Seng Yeoh Lai;Seong Law Che;Keat Ng Eng;Hooi Gooi Boon;Classe Francis;Li Susan
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
63.The Influence of Electromigration and Aging on the Reliability of SnAgCu Lead-Free Solder Joint at 100°C

机译：电迁移和时效对100°C下SnAgCu无铅焊点可靠性的影响
- 作者：Wei Guoqiang;Yao Jian;Shi Yonghua
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
- aging;
- electromigration;
- fracture;
- interfacial IMC;
- tensile strength;
64.Effects of the surface hardness of MIS leadframe on the bonding strength

机译：MIS引线框架的表面硬度对粘接强度的影响
- 作者：Guo Rui;Li Ming;Mao Dali;Li Weiping
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
65.Crosstalk analysis and optimization of high-speed interconnections

机译：高速互连的串扰分析和优化
- 作者：Wang Haidong;Song Jian;Liu Fengman;Xiang Haifei;Gao Wei;Wan Lixi
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
66.Characterization of the hot-cutting defects produced by the processing of alumina green tape

机译：表征氧化铝生带加工产生的热切缺陷
- 作者：Chao Zeng;Chunqing Wang;Yanhong Tian;Wei Liu;Rong An;Chunjing Hang
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
67.A comparative investigation of the electromigration behavior between wedge-type and line-type Cu/Sn3.0Ag0.5Cu/Cu interconnects

机译：楔型和线型Cu / Sn3.0Ag0.5Cu / Cu互连线之间电迁移行为的比较研究
- 作者：Wu Yue;Min-Bo Zhou;Hong-Bo Qin;Xun-Ping Li;Xiao M. A.;Xin-Ping Zhang
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
68.An advanced high speed solder ball impact method and its operation system

机译：一种先进的高速锡球冲击方法及其操作系统
- 作者：Zhang Yanbo;Zhang Zheming;Chen Haibin;Mclellan Neil;Wu Jingshen
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
69.Failure analysis techniques for high power light emitting diodes

机译：大功率发光二极管的故障分析技术
- 作者：Chen Run;Zhang Qin;Peng Tao;Jiao Feng;Liu Sheng
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
- Chemical decapsulation;
- Fluorescent penetrant inspection (FPI);
- High power LEDs;
- Nano-CT scanning;
- Reliability;
70.Comparison of charge injection in Si02 and Si3N4 for capacitive RF MEMS switches

机译：电容式RF MEMS开关在Si02和Si3N4中注入电荷的比较
- 作者：Li Gang;Hanke Ulrik;Chen Xuyuan
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
71.Finite element simulation of fracture behavior of BGA structure solder interconnects

机译：BGA结构焊料互连的断裂行为的有限元模拟
- 作者：Hong-Bo Qin;Bin Li;Xun-Ping Li;Xin-Ping Zhang
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
72.Sample preparation device for molding compound adhesion test

机译：用于模塑料附着力测试的样品制备装置
- 作者：Lu Qin;Zhang Wenjing;Li Ming;Mao Dali
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
73.Effect of rapid thermal cycles on the microstructure of single solder joint

机译：快速热循环对单焊点微观结构的影响
- 作者：Chen Jibing;Wu Yiping;An Bing
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
74.Reliability study on high power LED with chip on board

机译：板载芯片大功率LED的可靠性研究
- 作者：Liu Dongjing;Yang D.G.;Ren Rongbin;Hou Fengze;Huang Chao
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
75.Theoretical analysis on the element diffusion during thermomigration

机译：热迁移过程中元素扩散的理论分析
- 作者：Tao Y.;Ding L.;Wu Y. P.;Wu B. Y.;Cai M.
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
76.TEM study on the Cu wire stitch bonding interface

机译：铜丝线键合界面的TEM研究
- 作者：Liu Xingjie;Wang Techun;Cong Yuqi;Wang Jiaji
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
77.Study of internal stress on electroplating copper used in through silicon via filling

机译：硅通孔填充电镀铜内应力研究
- 作者：Feng Xue;Cao Haiyong;Yu Han;Gao Liming;Li Ming
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
78.Reliability test and simulation analyses for high power LED

机译：大功率LED的可靠性测试和仿真分析
- 作者：Weitao Zhu;Kailin Pan;Guotao Ren;Jing Huang
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
79.Numerical analysis of temperature and humidity effects on the reliability of high power light emitting diode

机译：温度和湿度对大功率发光二极管可靠性影响的数值分析
- 作者：Jing Huang;Kai-lin Pan;Peng Li;Shuang-ping Wang
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
80.The effect of thermal aging on the mechanical properties of molding compounds and the reliability of electronic packages

机译：热老化对模塑料的机械性能和电子封装可靠性的影响
- 作者：Yang Daoguo;Cui Zaifu
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
81.Corrosion behavior of 64Sn-35Bi-1Ag solder doped with Zn in NaCl solution and its electrochemical migration characteristics in high humid thermal condition for electronic packaging

机译：Zn掺杂的64Sn-35Bi-1Ag焊料在NaCl溶液中的腐蚀行为及其在电子包装高湿热条件下的电化学迁移特性
- 作者：Hua L.;Zhang J. S.
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
- 64Sn-35Bi-1Ag solder;
- Corrosion behavior;
- Electrochemical migration (ECM);
- Nono-crystals;
- Zn doping;
82.A new commixing sample preparation technology for the interface analysis of second wire bonding with TEM

机译：TEM二次键合界面分析的新型混合样品制备技术
- 作者：Liu Xingjie;Pu Haonan;Li Yuesheng;Wang Jiaji
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
83.A numerical method on thermal-humidity behavior of electronic packaging

机译：电子包装热湿行为的数值方法
- 作者：Mei Yue;Yao Xiaohu
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
84.The effect research of PCB microvia design on thermal fatigue life of WLCSP solder joints

机译：PCB微孔设计对WLCSP焊点热疲劳寿命的影响研究
- 作者：Jiazheng Hu;Zhaohua Wu
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
85.Study into high temperature reliability of isotropic conductive adhesive

机译：各向同性导电胶的高温可靠性研究
- 作者：Du Wenhui;Cui Huiwang;Chen Si;Yuan Zhichao;Ye Lilei;Liu Johan
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
86.Analysis of thermal spreading resistance in high power LED package and its design optimization

机译：大功率LED封装的散热电阻分析及其设计优化。
- 作者：Dong Shaojie;Zhou Qiang;Wang Minghua;Jiang Xiaoqing;Yang Jianyi
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
87.Structural design and heat dissipation research of integrated 3W white LED miner's lamp

机译：集成式3W白光LED矿灯的结构设计与散热研究
- 作者：Ren Rongbin;Yang Daoguo;Liu Dongjing
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
88.Effects of YAG: Ce phosphor particle size on optical performance of white LEDs

机译：YAG：Ce荧光粉粒径对白色LED光学性能的影响
- 作者：Liu Zong-Yuan;Li Cheng;Yu Bin-Hai;Wang Yao-Hao;Liu Sheng;Niu Han-Ben
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
89.Effect investigation of delamination on optical output of high power LEDs

机译：分层对大功率LED光学输出的影响研究
- 作者：Wu Bulong;Luo Xiaobing;Zhao Zhili;Liu Sheng
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
- Delamination;
- Light Extraction Efficiency;
- Light-Emitting Diode (LED);
90.Precise model of phosphor geometry formed in dispensing process of LED packaging

机译：LED封装分配过程中形成的荧光粉几何形状的精确模型
- 作者：Zheng Huai;Ma Jinlong;Luo Xiaobing;Liu Sheng
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
- LED;
- dispensing coating;
- phosphor geometry;
- precise model;
91.Effect of the amount of phosphor silicone gel on optical property of white light-emitting diodes packaging

机译：荧光粉硅酮凝胶的数量对白色发光二极管封装光学性能的影响
- 作者：Hu Run;Luo Xiaobing;Liu Sheng
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
92.Freeform lens design for uniform illumination with extended source

机译：自由形式的镜头设计，可通过扩展光源实现均匀照明
- 作者：Wu Dan;Wang Kai;Liu Sheng
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
93.3D silicon-based packaging for light emitting diodes

机译：基于3D硅的发光二极管封装
- 作者：Cao Bin;Yu Shan;Zheng Huai;Liu Sheng
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
94.Static and dynamic analysis for high power light emitting diode street light fixtures under wind load

机译：风荷载下大功率发光二极管路灯的静态和动态分析
- 作者：Liu Xiaogang;Chen Zhaohui;Liu Sheng
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
95.Effects of grooves substrate on thermal interface for the LED module

机译：凹槽基板对LED模块热界面的影响
- 作者：Peng Tao;Chen Mingxiang;Liu Xiaogang;Luo Xiaobing;Liu Sheng
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
- Thermal grease;
- groove substrate;
- pump out;
- reliability;
- thermal resistance;
96.Research on heat dissipation of high heat flux multi-chip GaN-based white LED lamp

机译：高热通量多芯片GaN基白色LED灯的散热研究
- 作者：Hou Fengze;Yang Daoguo;Zhang G.Q.;Liu Dongjing
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
97.Study of light emitting diodes for the application of plant growth in green house

机译：发光二极管在温室植物生长中的应用研究
- 作者：Fu Meijuan;Yang Lianqiao;Zhang Jianhua
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
98.Novel cooling solutions for LED solid state lighting

机译：LED固态照明的新型冷却解决方案
- 作者：Zhang Kai;Xiao David G. W.;Zhang Xiaohua;Fan Haibo;Gao Zhaoli;Yuen Matthew M. F.
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
99.Copper pillar bump technology progress overview

机译：铜柱凸块技术进展概述
- 作者：Koh Wei;Lin Barry;Tai Johnson
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年
100.Mechanical testing and analysis of polymer based flexible solar cell and full cell packaging

机译：聚合物基柔性太阳能电池和全电池包装的机械测试和分析
- 作者：Chen Xing;Liu Sheng
- 会议名称：《2011 12th International Conference on Electronic Packaging Technology High Density Packaging》 | 2011年