首页> 外文期刊>Journal of Electronic Materials >Nonvolatile Memory Effect in Indium Gallium Arsenide-Based Metal–Oxide–Semiconductor Devices Using II–VI Tunnel Insulators
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Nonvolatile Memory Effect in Indium Gallium Arsenide-Based Metal–Oxide–Semiconductor Devices Using II–VI Tunnel Insulators

机译:II-VI隧道绝缘体在基于砷化铟镓的金属-氧化物-半导体器件中的非易失性存储效应

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This paper reports the successful use of ZnSe/ZnS/ZnMgS/ZnS/ZnSe as a gate insulator stack for an InGaAs-based metal–oxide–semiconductor (MOS) device, and demonstrates the threshold voltage shift required in nonvolatile memory devices using a floating gate quantum dot layer. An InGaAs-based nonvolatile memory MOS device was fabricated using a high-κ II–VI tunnel insulator stack and self-assembled GeO x -cladded Ge quantum dots as the charge storage units. A Si3N4 layer was used as the control gate insulator. Capacitance–voltage data showed that, after applying a positive voltage to the gate of a MOS device, charges were being stored in the quantum dots. This was shown by the shift in the flat-band/threshold voltage, simulating the write process of a nonvolatile memory device.
机译:本文报道了成功地将ZnSe / ZnS / ZnMgS / ZnS / ZnSe用作基于InGaAs的金属氧化物半导体(MOS)器件的栅绝缘体叠层的方法,并演示了使用浮动器件的非易失性存储器件所需的阈值电压偏移门量子点层。使用高κII-VI隧道绝缘体堆叠和自组装的GeO x 包覆的Ge量子点作为电荷存储单元,制造了基于InGaAs的非易失性存储MOS器件。 Si 3 N 4 层用作控制栅绝缘体。电容-电压数据显示,在将正电压施加到MOS器件的栅极后,电荷被存储在量子点中。平坦带/阈值电压的变化表明了这一点,它模拟了非易失性存储器件的写入过程。

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