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Study of performance and leakage currents in nanometer-scale bulk, SOI and double-gate MOSFETs

机译:研究纳米级体,SOI和双栅极MOSFET中的性能和泄漏电流

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We consider the performance and leakage issues in 80-to-20 nm Ge, Si, and InGaAs bulk, SOI and Double-gate (DG) devices. The performance is studied with DAMOCLES, band-to-band tunneling processes with a nonlocal band-to-band model as a post-processor in DAMOCLES, and gate tunneling by a Green's function method accounting also for image force effects, so far ignored at 'internal' interfaces. The performance is affected by the bottleneck effect in III-Vs, especially for thin channels, but InGaAs and Ge still may be optimized to outperform Si. Zener leakage is high for Ge and tolerable for InGaAs. The effect of image forces led to an order of magnitude increase in gate tunneling currents.
机译:我们考虑了80至20 nm Ge,Si和InGaAs体,SOI和双栅(DG)器件的性能和泄漏问题。使用DAMOCLES,在DAMOCLES中使用非本地带对带模型作为后处理器的带对带隧穿过程以及通过格林函数方法进行的栅极隧穿来研究性能,该方法也考虑了图像力效应,到目前为止,在以下方面对此性能进行了研究。 “内部”接口。该性能受III-Vs的瓶颈效应影响,尤其是对于薄沟道而言,但InGaAs和Ge仍可进行优化以胜过Si。锗的齐纳漏电流高,InGaAs的容差高。镜像力的作用导致栅极隧穿电流增加一个数量级。

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