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Extraction of Energy Distribution of Nitride Traps Using Charge Pumping Method in Silicon-Oxide-Nitride-Oxide-Silicon Flash Memory

机译:用电荷泵法提取氮化硅阱中能量分布的氮化硅-氮化物-氧化硅-硅闪存

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摘要

A new charge pumping method is developed and applied to extract the energy distribution of nitride traps in silicon-oxide-nitride-oxide-silicon (SONOS) flash memory. Based on the Frenkel-Poole emission model and the tunneling probability given by Wentzel-Kramers-Brillouin (WKB) approximation, we proposed an advanced model of charge pumping current for SONOS device having thick tunnel oxide (> 3 nm). The detection range of trap energy depth in our experiment conditions is 1.06-1.24 eV. The extracted trap density distribution in energy levels of the nitride layer of prepared sample shows the peak trap density of 1.21 × 10~(20) eV~(-1) cm~(-3) at 1.17 eV while the peak trap density extracted using retention model is 6.24 × 10~(19) eV~(-1) cm~(-3) at 1.32 eV. This difference of the peak trap density and energy level at the peak trap density is originated from different tunneling probability of tunnel oxide during the measurement.
机译:开发了一种新的电荷泵方法,并将其应用于提取氧化硅-氮化物-氧化硅-硅(SONOS)闪存中氮化物陷阱的能量分布。基于Frenkel-Poole发射模型和Wentzel-Kramers-Brillouin(WKB)近似给出的隧穿概率,我们提出了一种具有较厚隧道氧化物(> 3 nm)的SONOS器件的电荷泵电流的高级模型。在我们的实验条件下,阱能深度的检测范围为1.06-1.24 eV。所制备样品的氮化物层能级中所提取的陷阱密度分布在1.17 eV处显示出1.21×10〜(20)eV〜(-1)cm〜(-3)的峰值陷阱密度,而使用保留模型在1.32 eV时为6.24×10〜(19)eV〜(-1)cm〜(-3)。峰值陷阱密度和峰值陷阱密度处的能级的这种差异源自测量期间隧道氧化物的不同隧穿概率。

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  • 来源
    《Japanese journal of applied physics》 |2009年第4issue2期|311-314|共4页
  • 作者单位

    Department of Electronics Engineering, Chungnam National University, Yusong-gu, Daejeon 305-764, Korea;

    Department of Electronics Engineering, Chungnam National University, Yusong-gu, Daejeon 305-764, Korea;

    Department of Electronics Engineering, Chungnam National University, Yusong-gu, Daejeon 305-764, Korea;

    Department of Electronics Engineering, Chungnam National University, Yusong-gu, Daejeon 305-764, Korea;

    Department of Electronics Engineering, Chungnam National University, Yusong-gu, Daejeon 305-764, Korea;

    Department of Electronics Engineering, Chungnam National University, Yusong-gu, Daejeon 305-764, Korea;

    Department of Electronics Engineering, Chungnam National University, Yusong-gu, Daejeon 305-764, Korea;

    Mobile and FLASH Division, Hynix Semiconductor Inc., Icheon, Kyoungki 467-701, Korea;

    Mobile and FLASH Division, Hynix Semiconductor Inc., Icheon, Kyoungki 467-701, Korea;

    Mobile and FLASH Division, Hynix Semiconductor Inc., Icheon, Kyoungki 467-701, Korea;

    Department of Electronics Engineering, Chungnam National University, Yusong-gu, Daejeon 305-764, Korea;

    Department of Electronics Engineering, Chungnam National University, Yusong-gu, Daejeon 305-764, Korea;

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