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Annealing influence on recovery of electrically stressed power vertical double-diffused metal oxide semiconductor transistors

机译:退火对电应力功率垂直双扩散金属氧化物半导体晶体管恢复的影响

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The effect of annealing on the recovery of electrically stressed power vertical double-diffused metal oxide semiconductor (VDMOS) transistors has been investigated. Behaviors of device threshold voltage and channel carrier mobility have been analyzed in terms of underlying changes in the densities of gate oxide charges and interface traps. The mechanisms responsible for the above-mentioned changes during the recovery of stressed devices have been analyzed as well. The annealing resulted in achieving stable threshold voltage and mobility, but did not ensure full recovery, as part of the stress-induced degradation remained permanent and could not be annealed. Namely, the annealing was found to enhance the neutralization of stress-induced oxide charges and the passivation of stress-induced interface traps, while the stability upon its completion resulted from the significantly decreased density of gate oxide charges and the possible balance between the processes of trap passivation and creation at the SiO2-Si interface. (C) 2015 The Japan Society of Applied Physics
机译:研究了退火对电应力功率垂直双扩散金属氧化物半导体(VDMOS)晶体管恢复的影响。已经根据栅氧化物电荷和界面陷阱的密度的根本变化来分析器件阈值电压和沟道载流子迁移率的行为。还分析了导致受压设备恢复期间上述变化的机制。退火导致达到稳定的阈值电压和迁移率,但不能确保完全恢复,因为应力引起的降解的一部分保持永久性并且无法退火。即,发现退火增强了应力诱导的氧化物电荷的中和作用和应力诱导的界面陷阱的钝化,而退火完成时的稳定性是由于栅极氧化物电荷的密度显着降低以及各工艺之间可能的平衡而产生的。捕获钝化并在SiO2-Si界面处生成。 (C)2015年日本应用物理学会

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