首页> 外文期刊>IEEE Transactions on Nuclear Science >Single Event Mechanisms in 90 nm Triple-Well CMOS Devices
【24h】

Single Event Mechanisms in 90 nm Triple-Well CMOS Devices

机译:90 nm三阱CMOS器件中的单事件机制

获取原文
获取原文并翻译 | 示例

摘要

Single event charge collection mechanisms in 90 nm triple-well NMOS devices are explained and compared with those of dual-well devices. The primary factors affecting the single event pulse width in triple-well NMOSFETs are the separation of deposited charge due to the n-well, potential rise in the p-well followed by the injection of electrons into the p-well by the source, and removal of holes by the p-well contact. Design parameters of p-wells, such as contact area, doping depth and placement, are varied to reduce single event pulse widths. Pulse width decreases as the area of the p-well contacts increases, the p-well contacts become deeper, and the p-well contacts are placed more frequently. Increasing the p-well—n-well junction depth also causes the full width half rail (FWHR) pulse width to decrease.
机译:介绍了90 nm三阱NMOS器件中的单事件电荷收集机制,并将其与双阱器件进行了比较。影响三阱NMOSFET中单事件脉冲宽度的主要因素是由于n阱造成的沉积电荷的分离,p阱中的电势上升,然后由源将电子注入p阱中,以及通过p阱接触去除孔。 p阱的设计参数(例如接触面积,掺杂深度和位置)会有所变化,以减小单事件脉冲宽度。脉冲宽度随着p型阱触点面积的增加而减小,p型阱触点变得更深,p型阱触点的放置频率更高。增加p阱-n阱结的深度也会导致全宽度半轨(FWHR)脉冲宽度减小。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号