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首页> 外文期刊>IEEE Transactions on Electron Devices >Simultaneous Quality Improvement of Tunneling- and Interpoly-Oxides of Nonvolatile Memory Devices by NH{sub}3 and N{sub}2O Nitridation
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Simultaneous Quality Improvement of Tunneling- and Interpoly-Oxides of Nonvolatile Memory Devices by NH{sub}3 and N{sub}2O Nitridation

机译:NH {sub} 3和N {sub} 2O氮化同时改善非易失性存储器件的隧穿氧化物和共氧化物

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摘要

This brief presents a new nitridation process on floating poly-Si gate to improve the quality of both tunneling oxide and inter-poly-oxide of nonvolatile memories. Three types of poly-Si for a floating gate have been investigated. We found in-situ doped poly-Si shows the best performance in terms of breakdown field, charge-to-breakdown (Q{sub}(BD)) and trapping rate. The Q{sub}(BD) of interpoly-oxide can be reached as high as 35 C/cm{sup}2. This scheme is very promising for nonvolatile memory devices.
机译:本简介介绍了一种新的氮化法工艺,该工艺用于在浮置多晶硅栅极上进行氮化,以改善非易失性存储器的隧穿氧化物和多晶硅间氧化物的质量。已经研究了三种用于浮栅的多晶硅。我们发现原位掺杂的多晶硅在击穿场,电荷击穿(Q {sub}(BD))和俘获率方面表现出最佳性能。间多氧化物的Q {sub}(BD)可以高达35 C / cm {sup} 2。该方案对于非易失性存储设备非常有前途。

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