Methodology for Solder-Joint Lifetime Prediction of LED-Based PCB Assemblies

摘要

A solder-joint crack due to thermal fatigue affects the reliability of light emitting diode assemblies. A new methodology is presented for the solder-joint lifetime estimation under a wide range of working conditions. The proposed method is based on the combination of reliability design of experiments, computer aided structural analysis validated by thermal-cycling experiments, and surface response modeling.