A Finite-Element-Based Solder-Joint Fatigue-Life Prediction Methodology for Sn–Ag–Cu Ball-Grid-Array Packages

Dauksher W.; Lau J.

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A Finite-Element-Based Solder-Joint Fatigue-Life Prediction Methodology for Sn–Ag–Cu Ball-Grid-Array Packages

机译：Sn-Ag-Cu球栅阵列封装的基于有限元的焊点疲劳寿命预测方法

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摘要

A finite-element-based modeling methodology for predicting the part-on-board fatigue life of lead-free solder balls is presented. The computationally efficient methodology is calibrated with a wide assortment of published test data.

机译：提出了一种基于有限元的建模方法来预测无铅焊锡球的零件在板上的疲劳寿命。计算效率高的方法论已使用各种已发布的测试数据进行了校准。

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《Device and Materials Reliability, IEEE Transactions on》 |2009年第2期|p.231-236|共6页
作者
Dauksher W.; Lau J.;
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正文语种 eng
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关键词
Fatigue; finite element; lead-free solder;

机译：疲劳;有限元;无铅焊料;

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专利

1. Intermetallic reactions in a Sn-3.5Ag-l.5In solder ball-grid-array package with Au/Ni/Cu pads [J] . Jie Chen, Jun Shen, Weidong Xie, Journal of materials science . 2011,第11期

机译：具有Au / Ni / Cu焊盘的Sn-3.5Ag-1.5In焊球网格阵列封装中的金属间反应
2. Intermetallic reactions in a Sn-3.5Ag-1.5In solder ball-grid-array package with Au/Ni/Cu pads [J] . Jie Chen, Jun Shen, Weidong Xie, Journal of Materials Science: Materials in Electronics . 2011,第11期

机译：具有Au / Ni / Cu焊盘的Sn-3.5Ag-1.5In焊料球栅阵列封装中的金属间反应
3. Solder joint reliability evaluation of Sn-Zn/Au/Ni/Cu ball-grid-array package during aging [J] . Jeong-Won Yoon, Seung-Boo Jung Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing . 2007,第Apr期

机译：Sn-Zn / Au / Ni / Cu球栅阵列封装在老化过程中的焊点可靠性评估
4. Reliability Prediction for 95.5Sn3.9Ag0.6Cu Solder Bump and Thermal Design for Lead Free System In Package with Polymer-Based Material [C] . Hsiang-Chen Hsu, Wei-Mao Hung International Conference on Advanced Manufacture; 20051128-1202; Taipei(CT) . 2006

机译：聚合物基材料封装的95.5Sn3.9Ag0.6Cu焊球可靠性预测和无铅系统的热设计
5. Mechanical properties and microstructure investigation of Sn-Ag-Cu lead free solder for electronic package applications. [D] . Wang, Qing. 2005

机译：电子封装应用中的Sn-Ag-Cu无铅焊料的机械性能和微观结构研究。
6. Sn–Ag–Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system [O] . Ali Roshanghias, Jan Vrestal, Andriy Yakymovych, -1

机译：Sn-Ag-Cu纳米焊料：三元系统富锡角中的熔融行为和相图预测
7. Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages [O] . M. D. Cheng, S. Y. Chang, S. F. Yen, 2004

机译：在Sn-3.8Ag-0.7Cu和Sn-20英寸-2Ag-0.5Cu焊球栅格的回流和老化期间形成的金属间化合物在SN-3.8AG-0.7CU和SN-20IN-2AG-0.5CU焊球栅格阵列套件
8. Fatigue-Life Prediction Methodology Using Small-Crack Theory [R] . Newmann, James C., Jr., Phillips, Edward P., Swain, M. H. 1997

机译：基于小裂纹理论的疲劳寿命预测方法

A Finite-Element-Based Solder-Joint Fatigue-Life Prediction Methodology for Sn–Ag–Cu Ball-Grid-Array Packages

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