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On comparing functional fault coverage and defect coverage for memory testing

机译:在比较功能故障覆盖率和缺陷覆盖率以进行内存测试时

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The manufacturing of high-quality and reliable semiconductor memories is very important. Many memory testing algorithms have been proposed to improve the quality of semiconductor memories by screening out different memory functional faults. However, the relationships between memory function fault types and the types of defects which cause the functional faults are not well understood. Therefore, the effectiveness of memory testing algorithms based on the functional fault models cannot be realistically determined. This paper evaluates the effectiveness of the memory testing algorithms based on the defect coverage by comparing the defect coverage of known memory testing algorithms and the functional fault coverage of the same testing algorithms using the same defect statistics. The experimental results show that the differences among the defect coverage of the 11 memory testing algorithms other than checkerboard and sliding diagonal tests were not significant as previously believed using memory functional fault coverage as the coverage metric.
机译:高质量和可靠的半导体存储器的制造非常重要。已经提出了许多存储器测试算法,以通过筛选出不同的存储器功能故障来提高半导体存储器的质量。但是,记忆功能故障类型与导致功能故障的缺陷类型之间的关系还没有被很好地理解。因此,无法实际确定基于功能故障模型的内存测试算法的有效性。本文通过比较已知内存测试算法的缺陷覆盖率和使用相同缺陷统计数据的相同测试算法的功能故障覆盖率,基于缺陷覆盖率评估内存测试算法的有效性。实验结果表明,除棋盘格和滑动对角线测试外,其他11种内存测试算法的缺陷覆盖率之间的差异并不显着,这是以前认为的使用内存功能故障覆盖率作为覆盖率度量标准的结果。

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