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Asymmetric Energy Distribution of Interface Traps in n- and p-MOSFETs With HfO{sub}2 Gate Dielectric on Ultrathin SiON Buffer Layer

机译:超薄SiON缓冲层上具有HfO {sub} 2栅极电介质的n和p-MOSFET中界面陷阱的不对称能量分布

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The variable rise and fall time charge-pumping technique has been used to determine the energy distribution of interface trap density (D{sub}(it)) in MOSFETs with a HfO{sub}2 gate dielectric grown on an ultrathin (<1 nm)-SiON buffer layer on Si. Our results have revealed that the (D{sub}(it)) is higher in the upper half of the bandgap than in the lower half of the bandgap, and are consistent with qualitative results obtained by the subthreshold current-voltage (I-V) measurements, capacitance-voltage (C-V), and ac conductance techniques. These results are also consistent with the observation that n-channel mobilities are more severely degraded than p-channel mobilities when compared to conventional MOSFETs with SiO{sub}2 or SiON as the gate dielectric.
机译:可变的上升和下降时间电荷泵技术已被用于确定在超薄(<1 nm)上生长HfO {sub} 2栅极电介质的MOSFET中界面陷阱密度(D {sub}(it))的能量分布)-Si上的SiON缓冲层。我们的结果表明,(D {sub}(it))在带隙的上半部比在带隙的下半部更高,并且与通过亚阈值电流-电压(IV)测量获得的定性结果一致,电容电压(CV)和交流电导技术。这些结果还与以下观察结果相一致:与使用SiO {sub} 2或SiON作为栅极电介质的常规MOSFET相比,n沟道迁移率比p沟道迁移率严重恶化。

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