首页> 外国专利> interface layer reduction method, the method of forming the high dielectric constant gate insulating film, a high dielectric constant gate insulating film, a high k gate oxide film, and a transistor having a high dielectric constant gate oxide layer

interface layer reduction method, the method of forming the high dielectric constant gate insulating film, a high dielectric constant gate insulating film, a high k gate oxide film, and a transistor having a high dielectric constant gate oxide layer

机译:界面层减少方法,高介电常数栅极绝缘膜的形成方法,高介电常数栅极绝缘膜,高k栅极氧化膜以及具有高介电常数栅极氧化层的晶体管

摘要

When deposited on a substrate of high dielectric constant film as issue gate insulating film, the interface layer of the SiO x or the like is formed at the interface therebetween, the effective dielectric constant of the gate insulating film is lowered. comprising the steps of: [SOLUTION] in (a) a semiconductor layer, forming a film of oxide of the first metal through the oxide layer of the semiconductor as an interfacial layer, an oxide of the metal (b) the first It is a surface layer reduction method on the membrane, and a step of forming a film of metal oxides large second valence than the first metal, reducing the thickness of the interfacial layer. [Selection] Figure Figure 1
机译:当在作为发行栅极绝缘膜的高介电常数膜的基板上沉积SiO x 等的界面层时,在它们之间的界面处,栅极绝缘膜的有效介电常数为降低。包括以下步骤:[解决方案]在(a)半导体层中,通过作为界面层的半导体的氧化物层形成第一金属的氧化物膜,(b)第一金属的氧化物。在膜上进行表面层还原的方法,以及形成第二价比第一金属大的第二价金属氧化物膜的步骤,从而减小界面层的厚度。 [选择]图图1

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