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首页> 外文期刊>IEEE Transactions on Electron Devices >A physical short-channel model for the thin-film SOI MOSFET applicable to device and circuit CAD
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A physical short-channel model for the thin-film SOI MOSFET applicable to device and circuit CAD

机译:适用于器件和电路CAD的薄膜SOI MOSFET的物理短通道模型

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摘要

A charge-based large-signal transient model for the enhancement-mode thin-film SOI MOSFET in strong inversion, suitable for circuit simulators such as SPICE, is presented. The model physically accounts for the predominant short-channel effects in MOSFET's (namely threshold-voltage reduction, drain-induced conductivity enhancement, velocity saturation with mobility degradation, and channel-length modulation) as influenced by the unique features of thin SOI devices (i.e. the presence of an additional back gate and the possibility of a floating film body). It includes a description of generation current due to (weak) impact ionization, which can have a far greater influence on SOI (as compared to bulk) MOSFET's due to the associated charging of the floating body. Measurements on devices of varied geometry show good agreement with model predictions. The model is implemented in SPICE2, to be used for circuit and device CAD, and TECAP, for automated parameter extraction.
机译:提出了一种适用于SPICE等电路仿真器的强反转型增强模式薄膜SOI MOSFET的基于电荷的大信号瞬态模型。该模型从物理上解释了受薄SOI器件的独特功能(即,MOSFET影响)的主要短沟道效应(即阈值电压降低,漏极感应的电导率增强,速度饱和以及迁移率降低以及沟道长度调制)。附加的背栅的存在以及浮膜主体的可能性)。它包括由于(弱)碰撞电离而产生的电流的描述,由于浮体的相关电荷,该电流对SOI MOSFET的影响(与大体积相比)要大得多。在各种几何形状的设备上进行的测量显示出与模型预测的良好一致性。该模型在SPICE2中实现,可用于电路和设备CAD,而TECAP可用于自动参数提取。

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