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Simulation of partially and near fully depleted SOI MOSFET devices and circuits using SPICE compatible physical subcircuit model

机译:使用兼容SPICE的物理子电路模型仿真部分和接近完全耗尽的SOI MOSFET器件和电路

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摘要

A four-terminal physical subcircuit model for floating body (FB) partially depleted (PD) and near fully depleted (near FD) SOI CMOS devices is presented. The model accounts for the unique characteristics of PD devices associated with the drain (V_(ds)) induced floating body effects. Unlike other models, the proposed circuit model accounts physically for the back MOSFET device, and accurately predicts the bias dependence of the current kink in near FD devices. It allows for proper capacitance scaling and more accurate simulations related to the front and back oxides/channels. Self-heating effects related to the low thermal conductivity of the back oxide are also included. The circuit model is SPICE compatible and provides insights for understanding optimal device design needs for high performance. A simple technique for extracting the model parameters is described. The model is verified by the good agreement of the simulation results with the experimental data. The predictive capabilities of the subcircuit model are supported by circuit level simulation examples.
机译:提出了一种用于浮体(FB)部分耗尽(PD)和接近完全耗尽(接近FD)SOI CMOS器件的四端子物理子电路模型。该模型考虑了与漏极(V_(ds))引起的浮体效应相关的PD设备的独特特性。与其他模型不同,所提出的电路模型在物理上考虑了后MOSFET器件,并准确预测了近FD器件中电流扭结的偏置依赖性。它允许适当的电容缩放以及与正面和背面氧化物/通道有关的更准确的模拟。还包括与背氧化层的低导热率有关的自热效应。该电路模型与SPICE兼容,可提供洞察力,以了解对高性能的最佳器件设计需求。描述了一种提取模型参数的简单技术。仿真结果与实验数据吻合良好,验证了模型的正确性。电路级仿真示例支持了子电路模型的预测能力。

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