首页> 外文期刊>IEEE Transactions on Electron Devices >Correlation of polysilicon thin-film transistor characteristics to defect states via thermal annealing
【24h】

Correlation of polysilicon thin-film transistor characteristics to defect states via thermal annealing

机译:通过热退火将多晶硅薄膜晶体管特性与缺陷状态相关

获取原文
获取原文并翻译 | 示例

摘要

Based on the response of electrical characteristics of hydro-genated polysilicon thin-film transistors (TFTs) to post-hydrogenation thermal annealing, the relationship of device parameters to deep states and tail states are distinguished. The deep states which affect the threshold voltage and subthreshold swing recover quickly, while the tail states which influence the leakage current and field effect mobility respond to the thermal annealing only after annealing temperatures exceeds 375/spl deg/C for 30 min.
机译:基于氢化多晶硅薄膜晶体管(TFT)的电特性对氢化后热退火的响应,可以区分器件参数与深态和尾态的关系。影响阈值电压和亚阈值摆幅的深状态迅速恢复,而影响泄漏电流和场效应迁移率的尾部状态仅在退火温度超过375 / spl deg / C 30分钟后才响应热退火。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号