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首页> 外文期刊>IEEE Transactions on Electron Devices >0.15-/spl mu/m buried-channel p-MOSFETs with ultrathin boron-doped epitaxial Si layer
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0.15-/spl mu/m buried-channel p-MOSFETs with ultrathin boron-doped epitaxial Si layer

机译:具有超薄掺硼外延硅层的0.15- / splμ/μm埋沟道p-MOSFET

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摘要

We demonstrated silicon MOSFETs with a counter-doped ultrathin epitaxial channel grown by low-temperature UHV-CVD; this allows the channel region to be doped with boron with high precision. The boron concentration and epitaxial layer thickness can be chosen independently, and so it is easy to adjust the threshold voltage of the buried-channel p-MOSFETs with n-type polysilicon gates. It was confirmed that choosing an ultrathin epitaxial layer at 10 nm leads to suppression of the short-channel effects in buried-channel p-MOSFETs with gate length down to 0.15 /spl mu/m, while maintaining an appropriate value of threshold voltage.
机译:我们演示了通过低温UHV-CVD生长具有反向掺杂的超薄外延沟道的硅MOSFET;这允许沟道区高精度地掺杂有硼。硼浓度和外延层厚度可以独立选择,因此很容易通过n型多晶硅栅极来调整埋入沟道p-MOSFET的阈值电压。可以确定的是,选择10nm的超薄外延层可以抑制栅长度降至0.15 / spl mu / m的埋入沟道p-MOSFET中的短沟道效应,同时保持适当的阈值电压值。

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