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Noise associated with interdigitated gate structures in RF submicron MOSFETs

机译:与射频亚微米MOSFET中的叉指式栅极结构相关的噪声

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CMOS technologies have gained considerable attention and have raised expectations for employment in RF transceivers. The shrinkage of the MOSFET device dimensions along with the relatively wide gate electrode devices needed to accommodate RF applications lead to reconsideration of the noise properties of submicron MOSFETs. In this paper, we present the noise properties associated with interconnect resistors of an interdigitated structure and the resulting noise source (strong function of the number of fingers) is evaluated against the other noise sources present in the device such as channel thermal noise, induced gate noise, and resistive gate voltage noise. Short channel effects have been taken into account for the evaluation of these noise sources and two-port analysis performed in order to calculate minimum noise figure and optimum input resistance for noise matching.
机译:CMOS技术已引起广泛关注,并提高了在射频收发器中使用的期望。 MOSFET器件尺寸的缩小,以及适应RF应用所需的相对较宽的栅电极器件,导致人们重新考虑了亚微米MOSFET的噪声特性。在本文中,我们介绍了与叉指结构互连电阻相关的噪声特性,并针对器件中存在的其他噪声源(例如通道热噪声,感应栅极)评估了产生的噪声源(指的数量的强函数)噪声和电阻性栅极电压噪声。为了评估这些噪声源并进行了两端口分析,已考虑了短通道效应,以便计算最小噪声系数和用于噪声匹配的最佳输入电阻。

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