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An Analytical Programming Model for the Drain-Coupling Source-Side Injection Split Gate Flash EEPROM

机译:漏极耦合源极侧注入分栅Flash EEPROM的解析编程模型

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This paper presents a compact and accurate analytical model for evaluating the programming behaviors of the drain-coupling source-side injection (SSI) split-gate Flash memory. Starting with the bias-dependent and time-varying drain coupling ratio, a programming model is developed on the basis of the constant barrier height approximation and Lucky-electron model to express the full transient injection current, peak lateral electric field, and storage charge as functions of technological, physical, and electrical parameters. The extracted re-direction mean-free path of the SSI device is smaller than that of the channel hot-electron counterpart by one order of magnitude, which provides the physical intuition for the derived high injection efficiency of around 2/1000. The intrinsic coupling ratio depends only on technological parameters and is presented as the design index of the device. The usefulness of this model is its ability of constructing the complete operation plot of the time-to-program versus the programming voltage for various reliability windows and tunable technological parameters. Besides, the variance of the read current distribution of a memory array is also analytically predicted.
机译:本文提出了一种紧凑而准确的分析模型,用于评估漏极耦合源极侧注入(SSI)分裂栅闪存的编程行为。从偏置相关且时变的漏极耦合比开始,在恒定势垒高度近似和Lucky-electron模型的基础上,开发了一个编程模型,将完整的瞬态注入电流,峰值横向电场和存储电荷表示为技术,物理和电气参数的功能。 SSI设备提取的重定向平均自由程比通道热电子对应物的重定向平均自由程小一个数量级,这为导出的大约2/1000的高注入效率提供了物理直觉。本征耦合比仅取决于技术参数,并表示为设备的设计指标。该模型的有用之处在于,它能够针对各种可靠性窗口和可调技术参数,构建出编程时间与编程电压的完整操作图。此外,还可以分析性地预测存储器阵列的读取电流分布的变化。

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