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Using soft secondary electron programming to reduce drain disturb in floating-gate nor flash EEPROMs

机译:使用软二次电子编程来减少浮栅或闪存EEPROM中的漏极干扰

摘要

A novel concept of soft secondary electron programming (SSEP) is introduced and shown to be a promising programming scheme for scaled NOR flash electrically erasable programmable read-only memories. Although the mechanism is similar to that of the channel-initiated secondary electron (CHISEL) programming, SSEP uses an "optimum" substrate bias that results in a lower drain disturb compared with both channel hot electron (CHE) and conventional CHISEL programming schemes. The concept behind minimizing drain disturb is discussed. SSEP is shown to give faster programming and lower disturb than CHE at all operating conditions, as well as better program/disturb margin compared with conventional CHISEL programming at similar program speed or disturb time. The effect of repeated program/erase cycling using SSEP is compared against CHE and CHISEL cycling.
机译:引入了一种新颖的软二次电子编程(SSEP)概念,并被证明是一种适用于规模化NOR闪存电可擦可编程只读存储器的编程方案。尽管其机理与通道引发的二次电子(CHISEL)编程相似,但SSEP使用“最佳”衬底偏置,与通道热电子(CHE)和常规CHISEL编程方案相比,其漏极干扰更低。讨论了最小化漏极干扰的概念。与传统的CHISEL编程相比,SSEP在所有工作条件下均具有比CHE更快的编程速度和更低的干扰,以及更高的编程/干扰余量。将使用SSEP的重复编程/擦除循环的效果与CHE和CHISEL循环进行比较。

著录项

  • 作者单位
  • 年度 2006
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  • 原文格式 PDF
  • 正文语种 en_us
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  • 入库时间 2022-08-20 20:17:21

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