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A $delta$-Doped InGaP/InGaAs pHEMT With Different Doping Profiles for Device-Linearity Improvement

机译:掺杂有$ delta $的InGaP / InGaAs pHEMT,具有不同的掺杂曲线,可改善器件的线性度

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In this paper, $delta$-doped InGaP/InGaAs pseudomorphic high-electron-mobility transistors (pHEMTs) with doping-profile modifications are investigated in order to improve the device linearity. The proposed modification was based on the third-order intermodulation distortion (IM3) and the third-order intercept point (IP3) analysis using a simple equivalent circuit of the devices. The correlations of the extrinsic transconductance (Gm) with IM3 and IP3 indicate that the flatness of Gm, as a function of gate-bias causes a lower IM3 level. On the other hand, a high Gm with a flatter Gm distribution results in higher IP3 value for the device. Therefore, doping modifications that improve the flatness of the Gm distribution will also improve the device linearity. Doping modifications in the Schottky layer (Schottky layer doped) and in the channel layer (channel doped) of the conventional $delta$-doped InGaP/InGaAs pHEMT were investigated. It was also found that extra doping, either in the channel region or in the Schottky layer, improved the flatness of the Gm distribution under different gate-bias conditions. This achieved a lower IM3 and a higher IP3 with a small sacrifice in the peak Gm value. The power performances of these devices were tested at different drain biases. Even though it had the lowest electron mobility among the three different types of devices studied, the channel-doped device demonstrated the best overall linearity performance, the highest IP3 value, the lowest IM3 level, and the best adjacent-channel power ratio under code-division multiple-access modulation.
机译:为了改善器件的线性度,本文研究了掺有掺杂轮廓的δ掺杂InGaP / InGaAs伪晶高电子迁移率晶体管(pHEMTs)。拟议的修改基于三阶互调失真(IM3)和三阶交调点(IP3)分析,使用的是简单的器件等效电路。外在跨导(Gm)与IM3和IP3的相关性表明,Gm的平坦度作为栅极偏置的函数会导致IM3电平降低。另一方面,高Gm和更平坦的Gm分布会导致设备的IP3值更高。因此,改善Gm分布的平坦度的掺杂修饰也会改善器件的线性度。研究了传统的掺δInGaP / InGaAs pHEMT的肖特基层(掺杂了肖特基层)和沟道层(掺杂了沟道)中的掺杂改性。还发现在沟道区或肖特基层中的额外掺杂改善了在不同的栅极偏置条件下Gm分布的平坦度。这样实现了较低的IM3和较高的IP3,而Gm峰值的牺牲很小。这些器件的功率性能在不同的漏极偏置条件下进行了测试。即使在研究的三种不同类型的器件中,它具有最低的电子迁移率,该信道掺杂的器件也表现出最佳的整体线性性能,最高的IP3值,最低的IM3电平以及在编码下的最佳邻道功率比。除法多址调制。

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