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OFF-State Degradation of AlGaN/GaN Power HEMTs: Experimental Demonstration of Time-Dependent Drain-Source Breakdown

机译:AlGaN / GaN功率HEMT的关态降解:随时间变化的漏极-源极击穿的实验演示

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This paper reports the experimental demonstration of a novel degradation mechanism of high-power AlGaN/GaN high electron mobility transistors (HEMTs), that is, time-dependent drain-source breakdown. With current-controlled breakdown measurements and constant voltage stress experiments we demonstrate that: 1) when submitted to constant voltage stress, in the OFF-state, the HEMTs can show a significant degradation; 2) the degradation process is time-dependent, and consists of a measurable increase in subthreshold drain-source leakage; this effect is ascribed to the accumulation of positive charge in proximity of the gate, consistently with previous theoretical calculations; and 3) a catastrophic (and permanent) failure is observed for long stress times, possibly due to thermal runaway or to the increase in the electric field in proximity of the localized drain-source leakage paths.
机译:本文报告了高功率AlGaN / GaN高电子迁移率晶体管(HEMT)的一种新型降解机制的实验演示,即随时间变化的漏源击穿。通过电流控制击穿测量和恒定电压应力实验,我们证明:1)当处于恒定电压应力下时,在截止状态下,HEMT会表现出明显的退化; 2)退化过程是时间相关的,并且包括亚阈值漏源泄漏的可测量增加;这种影响归因于栅极附近正电荷的积累,与先前的理论计算一致; 3)在很长的应力时间内观察到灾难性(和永久性)故障,这可能是由于热失控或局部漏源泄漏路径附近电场的增加所致。

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