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A Novel Vertical Field Plate Lateral Device With Ultralow Specific On-Resistance

机译:具有超低比导通电阻的新型垂直场板横向装置

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A novel vertical field plate (VFP) lateral device with ultralow specific on-resistance $(R_{{rm ON},{rm sp}})$ is proposed in this paper. The VFP surrounded by oxide is inserted in the bulk of the drift region. Compared to the surface local depletion of the conventional lateral field plate (LFP), the depletion layer of the VFP expands to the bulk of the drift region, which enhances the bulk electric field. Therefore, ultralow $R_{{rm ON},{rm sp}}$ is realized in the VFP device due to high drift-region doping $(N_{d})$ and short cell pitch. An analytical FP model is developed to describe the behavior of the VFP, in which the breakdown voltage (BV) and $N_{d}$ are found to be proportional to the FP factor $k$. Then the uniform-doped VFP laterally diffused MOSs and the step-doped VFP laterally diffused MOS are proposed. The optimized device exhibits a BV of 945 V and a $R_{{rm ON},{rm sp}}$ of 34 ${rm m}Omegacdot{rm cm}^{2}$ which are superior to those of similar devices and the silicon limit.
机译:本文提出了一种新型的具有超低导通电阻$(R _ {{rm ON},{rm sp}}} $的垂直场板(VFP)横向器件。被氧化物包围的VFP插入大部分漂移区中。与常规横向场板(LFP)的表面局部耗尽相比,VFP的耗尽层扩展到漂移区的大部分,从而增强了整体电场。因此,由于高漂移区掺杂$(N_ {d})$和单元间距短,在VFP器件中实现了超低的$ R _ {{rm ON},{rm sp}} $。开发了一种分析型FP模型来描述VFP的行为,其中发现击穿电压(BV)和$ N_ {d} $与FP因子$ k $成正比。然后提出了均匀掺杂的VFP横向扩散MOS和阶梯掺杂的VFP横向扩散MOS。经过优化的设备具有945 V的BV和34美元的$ R _ {{rm ON},{rm sp}} $$ {rm m} Omegacdot {rm cm} ^ {2} $,优于同类设备和硅限制。

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