首页> 外国专利> LATERAL POWER DEVICE HAVING LOW SPECIFIC ON-RESISTANCE AND USING HIGH-DIELECTRIC CONSTANT SOCKET STRUCTURE AND MANUFACTURING METHOD THEREFOR

LATERAL POWER DEVICE HAVING LOW SPECIFIC ON-RESISTANCE AND USING HIGH-DIELECTRIC CONSTANT SOCKET STRUCTURE AND MANUFACTURING METHOD THEREFOR

机译:具有低比导通电阻的横向功率器件,并采用高介电常数插座结构及其制造方法

摘要

Provided are a lateral power device having low specific ON-resistance and using a high-dielectric constant socket structure and a manufacturing method therefor, which relate to semiconductor power devices. A source electrode (8) of the device is of a first conduction type, and a channel region (6), a silicon substrate (4) and an ohmic contact heavily-doped region are of a second conduction type; at least two isolation regions are arranged in an embedded manner in a drift region (1); between the isolation regions are the drift region (1) and the channel region (6); each isolation region extends from the source electrode (8) to a drain electrode (11); high-dielectric constant material strips (3) and first insulation dielectric layers (10) form boundaries of the bottoms and sidewalls of the isolation regions; the isolation regions are filled with a first filling material (2), a second insulation dielectric layer (9) is arranged on the upper surface of the drift region (1) and the upper surfaces of the isolation regions, and a gate electrode (5) directly contacts the first filling material (2) via holes on the second insulation dielectric layer (9); and a source electrode lead-out wire (16) and a drain electrode lead-out wire (12) directly contact the source electrode (8) and the drain electrode (11) respectively via the holes on the second insulation dielectric layer (9). The area of a power device can be greatly reduced on the premise of not reducing the withstand voltage and not increasing the specific ON-resistance.
机译:提供了一种具有低比导通电阻并且使用高介电常数插座结构的横向功率器件及其制造方法,涉及半导体功率器件。器件的源电极(8)是第一导电类型,沟道区(6),硅衬底(4)和欧姆接触重掺杂区是第二导电类型。在漂移区域(1)中至少两个隔离区域被嵌入地布置。在隔离区之间是漂移区(1)和沟道区(6);每个隔离区从源电极(8)延伸到漏电极(11)。高介电常数材料带(3)和第一绝缘介电层(10)形成隔离区的底部和侧壁的边界。隔离区填充有第一填充材料(2),第二绝缘电介质层(9)布置在漂移区(1)的上表面和隔离区的上表面上,并且栅电极(5) )通过第二绝缘介电层(9)上的孔直接接触第一填充材料(2);源极引出线(16)和漏极引出线(12)分别经由第二绝缘电介质层(9)上的孔与源极(8)和漏极(11)直接接触。 。在不降低耐压且不增加比导通电阻的前提下,可以大大减小功率器件的面积。

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