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Study of Hot-Carrier-Induced Traps in Nanoscale UTBB FD-SOI MOSFETs by Low-Frequency Noise Measurements

机译:通过低频噪声测量研究纳米级UTBB FD-SOI MOSFET中的热载流子陷阱

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The hot carrier (HC)-induced traps in nanoscale fully depleted ultrathin body and buried oxide nMOSFETs are investigated by low-frequency noise (LFN) measurements in the frequency and time domains. The measured noise spectra are composed of 1/f and Lorentzian-type components. The Lorentzian noise is due to either generation-recombination noise or random telegraph noise (RTN). Based on the LFN results, the effect of the HC stress on fully depleted silicon-on-insulator MOSFETs is investigated after short- and long-time stress. The capture and emission time constants responsible for the RTN noise were calculated as the average duration time of the high/low drain current state, respectively. Analysis of RTN traps detected in fresh and HC-stressed devices indicates that the RTN amplitude is uncorrelated to the trap time constants, i.e., the impact of the trap depth from the interface is masked by that of the trap location over the channel. The overall results lead to an analytical expression for the RTN amplitude, enabling to predict the RTN changes from the subthreshold to the above-threshold region.
机译:通过在频域和时域中的低频噪声(LFN)测量,研究了纳米级完全耗尽的超薄体和掩埋氧化物nMOSFET中热载流子(HC)引起的陷阱。测得的噪声频谱由1 / f和洛伦兹型分量组成。洛伦兹噪声是由于产生重组噪声或随机电报噪声(RTN)引起的。根据LFN结果,在短期和长期应力后,研究了HC应力对完全耗尽的绝缘体上硅MOSFET的影响。负责RTN噪声的捕获和发射时间常数分别计算为高/低漏极电流状态的平均持续时间。对在新鲜和受HC胁迫的设备中检测到的RTN陷阱的分析表明,RTN振幅与陷阱时间常数不相关,即,陷阱界面处陷阱深度的影响被通道上陷阱位置的影响所掩盖。总体结果导致了RTN幅度的解析表达式,从而可以预测RTN从亚阈值到阈值以上区域的变化。

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