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Low-Frequency Noise Sources in Advanced UTBB FD-SOI MOSFETs

机译:先进的UTBB FD-SOI MOSFET中的低频噪声源

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摘要

The low-frequency noise (LFN) sources in ultrathin body (8.7 nm) and buried oxide (10 nm) fully depleted silicon-on-insulator (UTBB FD-SOI) n- and p-channel MOSFETs are analyzed. Both flicker and Lorentzian-type noise were observed, showing a dependence on the channel dimensions and the front/back gate bias conditions. The flicker noise component can be described by the carrier number with correlated mobility fluctuations model considering contribution from both interfaces. The Lorentzian-type noise originates mainly from generation-recombination (g-r) traps in the Si film, uniformly distributed in thin layers next to the drain and source contacts, and in some cases from g-r traps located at the front Si/oxide interface. No different noise behavior was observed between n- and p-channel devices operating in front-gate mode. Finally, LFN comparison between FD-SOI devices of different technologies is presented for the first time, demonstrating the impact of the UTBB technology on the LFN properties.
机译:分析了超薄体(8.7 nm)和掩埋氧化物(10 nm)的全耗尽型绝缘体上硅(UTBB FD-SOI)n沟道和p沟道MOSFET的低频噪声(LFN)源。闪烁和洛伦兹型噪声都被观察到,显示出对沟道尺寸和前/后栅极偏置条件的依赖性。考虑到两个接口的贡献,可以通过具有相关迁移率波动模型的载波号来描述闪烁噪声分量。洛伦兹型噪声主要源自Si膜中的生成复合(g-r)陷阱,均匀地分布在漏极和源极触点旁边的薄层中,在某些情况下,还来自位于前Si /氧化物界面的g-r陷阱。在前门模式下工作的n通道和p通道设备之间没有观察到不同的噪声行为。最后,首次介绍了不同技术的FD-SOI器件之间的LFN比较,证明了UTBB技术对LFN性能的影响。

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