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Implementation of Band-to-Band Tunneling Phenomena in a Multisubband Ensemble Monte Carlo Simulator: Application to Silicon TFETs

机译:多子带集成蒙特卡罗仿真器中的带间隧道现象的实现:在硅TFET中的应用

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摘要

Tunnel FETs (TFETs) are in the way to become an alternative to conventional MOSFETs due to the possibility of achieving low subthreshold swing combined with small OFF current levels, which allows operation at low VDD . In this paper, a nonlocal band-to-band tunneling model has been successfully implemented into a multisubband ensemble Monte Carlo (MS-EMC) simulator and applied to ultrascaled silicon-based n-type TFETs. We have considered two different criteria for the choice of the tunneling path followed by the carriers when crossing the potential barrier, which leads to different distributions of the generated electron–hole pairs. Subband discretization due to field–induced quantum confinement has been considered. TCAD simulations accounting for quantization effects are considered for comparison purposes providing a very accurate agreement with MS-EMC results.
机译:隧道FET(TFET)有望成为传统MOSFET的替代产品,因为它有可能实现较低的亚阈值摆幅以及较小的OFF电流水平,从而可以在低VDD的条件下工作。在本文中,已经成功地将非局部带间隧道模型实现到多子带集成蒙特卡洛(MS-EMC)仿真器中,并将其应用于超大规模基于硅的n型TFET。我们已经考虑了两种不同的选择隧穿路径的标准,这些选择是在穿越势垒时,载流子遵循的隧穿路径,从而导致生成的电子-空穴对的分布不同。已经考虑了由于场致量子限制而引起的子带离散化。考虑到比较效果,考虑了考虑到量化影响的TCAD仿真,以便与MS-EMC结果非常准确地吻合。

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