首页> 外文期刊>IEEE Transactions on Electron Devices >Multisubband Ensemble Monte Carlo Analysis of Tunneling Leakage Mechanisms in Ultrascaled FDSOI, DGSOI, and FinFET Devices
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Multisubband Ensemble Monte Carlo Analysis of Tunneling Leakage Mechanisms in Ultrascaled FDSOI, DGSOI, and FinFET Devices

机译:超小型FDSOI,DGSOI和FinFET器件中隧道泄漏机理的多子带集成蒙特卡罗分析

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摘要

Leakage phenomena are increasingly affecting the performance of nanoelectronic devices, and therefore, advanced device simulators need to include them in an appropriate way. This paper presents the modeling and implementation of direct source-to-drain tunneling (S/D tunneling), gate leakage mechanisms (GLMs) accounting for both direct tunneling and trap-assisted tunneling, and nonlocal band-to-band tunneling (BTBT) phenomena in a multissubband ensemble Monte Carlo (MS-EMC) simulator along with their simultaneous application for the study of ultrascaled fully depleted silicon-on-insulator, double-gate silicon-on-insulator, and FinFET devices. We find that S/D tunneling is the prevalent phenomena for the three devices, and it is increasingly relevant for short-channel lengths.
机译:泄漏现象越来越多地影响纳米电子设备的性能,因此,高级设备模拟器需要以适当的方式包括它们。本文介绍了直接源极到漏极隧道(S / D隧道),考虑了直接隧道和陷阱辅助隧道的栅极泄漏机制(GLM)以及非本地频带到隧道(BTBT)的建模和实现多子带集成蒙特卡罗(MS-EMC)仿真器中的现象以及它们的同时应用,用于研究超大规模的完全耗尽型绝缘体上硅,双栅绝缘体上硅和FinFET器件。我们发现,S / D隧穿是这三种设备的普遍现象,并且与短通道长度越来越相关。

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