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Source-to-Drain Tunneling Analysis in FDSOI, DGSOI, and FinFET Devices by Means of Multisubband Ensemble Monte Carlo

机译:FDSOI,DGSOI和FinFET器件中的源-漏隧穿分析,通过多子带集成Monte Carlo进行

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The inclusion of quantum effects in the transport direction plays an important role in the extensive research of ultrascaled electronic devices. In this context, it is necessary to study how these phenomena affect different technological architectures in order to conclude which one can be the best candidate to replace standard technology. This paper presents the implementation of direct source-to-drain tunneling effect in a multisubband ensemble Monte Carlo simulator showing its influence in different structures such as fully depleted silicon-on-insulator, double-gate silicon-on-insulator, and FinFET devices. The differences in the potential profile and the electron distribution in the subbands for these architectures modify the number of electrons affected by this quantum mechanism and, therefore, their short-channel behavior.
机译:在超尺度电子设备的广泛研究中,在传输方向上包含量子效应起着重要作用。在这种情况下,有必要研究这些现象如何影响不同的技术架构,以便得出结论,哪种可能是替代标准技术的最佳人选。本文介绍了在多子带集成蒙特卡罗仿真器中实现直接源极到漏极隧穿效应的方法,展示了它在不同结构(如完全耗尽的绝缘体上硅,绝缘栅双栅极和FinFET器件)中的影响。对于这些架构,子带中的电位分布和电子分布的差异会修改受此量子机制影响的电子数量,从而改变其短沟道行为。

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