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New Super-Junction LDMOS Breaking Silicon Limit by Multi-Ring Assisted Depletion Substrate

机译:通过多环辅助耗尽衬底突破硅极限的新型超结LDMOS

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A novel super-junction (SJ) lateral double-diffused MOSFET with the multi-ring substrate (M-R SJ-LDMOS) is proposed for the first time. The substrate-assisted depletion (SAD) effect is eliminated by the n-type M-R to realize a balanced symmetric SJ with the low specific ON-resistance ( ${R}_{ext {on,sp}}$ ). Meanwhile, more uniform lateral and vertical electric field distributions are obtained under the surface and bulk electric field modulation effect, which leads to the enhancement of breakdown voltage (BV). The simulation results show that the BV of M-R SJ-LDMOS is increased by 427.2 % and 81.2 % in comparison with the conventional SJ-LDMOS and buffered step doping (BSD) SJ-LDMOS with the same drift region length, respectively. In addition, ${R}_{ext {on,sp}}$ of M-R SJ-LDMOS is reduced by 18.6 % and 80.3 % than that of BSD SJ-LDMOS and the conventional SJ-LDMOS. The figure-of-merit (FOM) of M-R SJ-LDMOS is 5.81 MW/cm(2), which means the performance of M-R SJ-LDMOS is so excellent to break the silicon limit. +Moreover, the application of highly doped substrate ( ${3} imes {10}{{15}}$ cm(-3)) in M-R SJ-LDMOS cuts the cost of substrate.
机译:首次提出了一种具有多环衬底的新型超结(SJ)横向双扩散MOSFET(M-R SJ-LDMOS)。 n型M-R消除了衬底辅助的耗尽(SAD)效应,从而实现了低导通电阻($ {R} _ { text {on,sp}} $)的平衡对称SJ。同时,在表面电场和体电场调制效应的作用下,可获得更均匀的横向和纵向电场分布,从而提高了击穿电压(BV)。仿真结果表明,与具有相同漂移区长度的常规SJ-LDMOS和缓冲步掺杂(BSD)SJ-LDMOS相比,M-R SJ-LDMOS的BV分别提高了427.2%和81.2%。此外,M-R SJ-LDMOS的$ {R} _ { text {on,sp}} $比BSD SJ-LDMOS和常规SJ-LDMOS减少了18.6%和80.3%。 M-R SJ-LDMOS的品质因数(FOM)为5.81 MW / cm(2),这意味着M-R SJ-LDMOS的性能非常出色,可以突破硅极限。 +此外,在M-R SJ-LDMOS中应用高掺杂衬底($ {3} 乘以{10} {{15}} $ cm(-3)可以降低衬底的成本。

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