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High-performance devices for a 0.15- mu m CMOS technology

机译:适用于0.15微米CMOS技术的高性能器件

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Devices have been designed and fabricated in a CMOS technology with a nominal channel length of 0.15 mu m and minimum channel length below 0.1 mu m. In order to minimize short-channel effects (SCEs) down to channel lengths below 0.1 mu m, highly nonuniform channel dopings (obtained by indium and antimony channel implants) and shallow source-drain extensions/halo (by In and Sb preamorphization and low-energy As and BF/sub 2/ implant were used. Maximum high V/sub DS/ threshold rolloff was 250 mV at effective channel length of 0.06 mu m. For the minimum channel length of 0.1 mu m, the loaded (FI=FO=3, C=240 fF) and unloaded delays were 150 and 25 ps, respectively.
机译:器件采用CMOS技术进行设计和制造,标称沟道长度为0.15微米,最小沟道长度低于0.1微米。为了将短沟道效应(SCE)最小化到小于0.1μm的沟道长度,高度不均匀的沟道掺杂(通过铟和锑沟道注入获得)和浅的源极/漏极扩展区/卤化物(通过In和Sb预非晶化以及低掺杂)使用能量As和BF / sub 2 /注入。有效通道长度为0.06μm时,最大高V / sub DS /阈值滚降为250 mV。对于最小通道长度为0.1μm,负载(FI = FO = 3,C = 240 fF),空载延迟分别为150和25 ps。

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