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A Novel 1200-V LDMOSFET With Floating Buried Layer in Substrate

机译:新型的具有浮置埋层的1200V LDMOSFET

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A novel 2-$muhbox{m}$ thin-drift-layer power MOSFET with an n-type floating buried layer (FBL) in substrate is proposed in this letter. Since the charges in the buried layer modulate the bulk electric field, a nearly uniform electric field is obtained, and the vertical breakdown voltage $(BV)$ is significantly improved. Simulation results show that the $BV$ of the proposed FBL lateral double-diffused MOSFET (LDMOSFET) is increased from 743 V of the conventional LDMOSFET to 1332 V with the same 100 $muhbox{m}$ drift region length. Furthermore, the figure-of-merit of the FBL-LDMOSFET is better than that of the conventional LDMOSFET.
机译:本文提出了一种新颖的2- $ muhbox {m} $薄漂移层功率MOSFET,其衬底中具有n型浮置埋层(FBL)。由于掩埋层中的电荷调制整体电场,因此获得了几乎均匀的电场,并且垂直击穿电压$(BV)$得到了显着改善。仿真结果表明,在漂移区长度相同的情况下,建议的FBL横向双扩散MOSFET(LDMOSFET)的$ BV $从常规LDMOSFET的743 V增加到了1332V。此外,FBL-LDMOSFET的品质因数优于常规LDMOSFET。

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