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首页> 外文期刊>Electron Device Letters, IEEE >Investigation of Gate Etch Damage at Metal/High- Gate Dielectric Stack Through Random Telegraph Noise in Gate Edge Direct Tunneling Current
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Investigation of Gate Etch Damage at Metal/High- Gate Dielectric Stack Through Random Telegraph Noise in Gate Edge Direct Tunneling Current

机译:通过栅极边缘直接隧穿电流中的随机电报噪声研究金属/高栅极电介质堆叠中的栅极蚀刻损伤

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摘要

Plasma damage on a high-$khbox{/SiO}_{2}$ dielectric at a gate edge during a dry etch process is investigated. The damage was observed to generate slow oxide traps, causing a random telegraph noise (RTN) in a gate edge direct tunneling current. Through the analysis of the RTN, the distribution of the oxide traps in the high-$khbox{/SiO}_{2}$ dielectric was obtained, and the plasma-damage-induced oxide traps were found to be distributed over a wide area of the high-$khbox{/SiO}_{2}$ sidewall at the gate edge region.
机译:研究了在干法刻蚀过程中,栅极边缘的高$ khbox {/ SiO} _ {2} $电介质对等离子体的损害。观察到损坏会产生缓慢的氧化物陷阱,从而在栅极边缘直接隧穿电流中产生随机电报噪声(RTN)。通过对RTN的分析,得到高$ khbox {/ SiO} _ {2} $电介质中氧化物陷阱的分布,发现等离子体损伤引起的氧化物陷阱分布在较宽的区域栅极边缘区域的高$ khbox {/ SiO} _ {2} $侧壁的厚度。

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