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High-Performance Oxide TFTs With Co-Sputtered Indium Tin Oxide and Indium-Gallium-Zinc Oxide at Source and Drain Contacts

机译:具有共溅射的氧化铟锡和源极和漏极触点的高性能氧化物TFT和氧化铟 - 氧化锌

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Amorphous indium-gallium-zinc oxide (IGZO) thin-film transistors (TFTs) have shown significant potential for application in transparentandflexible electronicdevices. However, the sourceand drain (S/D) electrodesof IGZOTFTs with indium tin oxide (ITO) thin films can cause Schottkylike behavior in the output characteristics owing to the formation of a potential barrier between the IGZO and ITO thin films. In this study, we designed and fabricated TFTs by applying a novel ITO S/D electrode layer (375 nm) with co- sputtered IGZO and ITO thin films (125 nm) deposited at room temperature. The proposed TFT exhibits superior electric characteristics (mu(sat) = 35.4 cm(2)/Vs) compared to those of TFTs with conventional ITO electrodes (mu sat = 9.1 cm(2)/Vs) owing to its lower contact and channel resistance and the generation of a surface reaction between S/D and channel layers, creating additional oxygen vacancies at the IGZO channel region. The proposed S/D electrode could be fabricatedon a glass substrate at lowtemperatures (below 200 degrees C). The excellent electrical properties of the proposed IGZO TFT are expected to promote the application of TFTs in advanced displays.
机译:无定形铟 - 镓 - 氧化锌(IGZO)薄膜晶体管(TFT)显示了在透明和柔性电子设备中应用的显着潜力。然而,具有氧化铟锡(ITO)薄膜的酸氨酸漏极(S / D)电极电极可能导致输出特性中的Schottkykykike行为,由于在IGZO和ITO薄膜之间形成潜在的屏障。在该研究中,我们通过在室温下涂覆具有沉积的掺杂的ITO S / D电极层(375nm)来设计和制造的TFT和沉积的ITO薄膜(125nm)。与具有常规ITO电极的TFT的TFT相比,所提出的TFT表现出优异的电特性(MU(SAT)= 35.4cm(2)/ Vs),由于其较低的接触和沟道电阻并且在S / D和沟道层之间产生表面反应,在IGZO沟道区产生额外的氧空位。所提出的S / D电极可以在Lowtemperatures(低于200℃)的玻璃基板中。建议的IGZO TFT的出色电气性能预计将促进TFT在高级显示器中的应用。

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