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Low-temperature formation of source-drain contacts in self-aligned amorphous oxide TFTs

机译:自对准非晶氧化物TFT中源漏接触的低温形成

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摘要

We demonstrated self-aligned amorphous-Indium-Gallium-Zinc-Oxide (a-IGZO) thin-film transistors (TFTs) where the source–drain (S/D) regions were made conductive via chemical reduction of the a-IGZO via metallic calcium (Ca). Due to the higher chemical reactivity of Ca, the process can be operated at lower temperatures. The Ca process has the additional benefit of the reaction byproduct calcium oxide being removable through a water rinse step, thus simplifying the device integration. The Ca-reduced a-IGZO showed a sheet resistance (RSHEET) value of 0.7 kΩ/sq., with molybdenum as the S/D metal. The corresponding a-IGZO TFTs exhibited good electrical properties, such as a field-effect mobility (μFE) of 12.0 cm2/(V s), a subthreshold slope (SS−1) of 0.4 V/decade, and an on/off current ratio (ION/OFF) above 108.
机译:我们展示了自对准无定形铟镓锌氧化物(a-IGZO)薄膜晶体管(TFT),其中通过金属对a-IGZO进行化学还原,使源-漏(S / D)区导电钙(Ca)。由于Ca的化学反应性较高,因此该方法可以在较低的温度下运行。 Ca工艺具有通过水冲洗步骤可除去反应副产物氧化钙的额外好处,从而简化了装置集成。 Ca还原的a-IGZO的薄层电阻(RSHEET)值为0.7ofkΩ/ sq。,钼为S / D金属。相应的a-IGZO TFT表现出良好的电性能,例如12.0 cm2 /(V s)的场效应迁移率(μFE),0.4 V /十倍的亚阈值斜率(SS-1)和开/关电流比率(ION / OFF)高于108。

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